$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Load lock pumping mechanism 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-013/08
출원번호 US-0609052 (1984-05-10)
발명자 / 주소
  • Ackley James W. (Los Altos CA)
출원인 / 주소
  • Varian Associates, Inc. (Palo Alto CA 02)
인용정보 피인용 횟수 : 77  인용 특허 : 6

초록

In a vacuum system for processing workpieces, a vacuum chamber has a workpiece-entrance opening. Load lock means for said entrance opening include a door for sealing the outside of said opening, a movable closure member within the chamber to seal the entrance opening from the interior of the vacuum

대표청구항

A pumping mechanism for a vacuum chamber comprising: a load lock having a front closure means through which a workpiece is inserted into said chamber and a rear closure means; said rear closure means having wall means forming a movable mini-chamber which forms a connection with an external pumping m

이 특허에 인용된 특허 (6)

  1. Luscher Paul E. (Sunnyvale CA), Transfer and temperature monitoring apparatus.
  2. Rosvold Warren C. (Sunnyvale CA), Vacuum sputtering apparatus.
  3. Kakei Mitsuo (Tokyo JA) Nishida Keijiro (Kanagawa JA) Kasahara Tadayoshi (Hino JA) Shimabayashi Masao (Kawasaki JA) Hiraga Ryozo (Yokohama JA) Nakano Tomomasa (Yokohama JA) Komatsubara Ichiro (Tokyo , Vapor deposition apparatus.
  4. Nishida Keijiro (Nimomiya JPX) Kakei Mitsuo (Tokyo JPX) Kamiya Osamu (Yokohama JPX) Sekimura Nobuyuki (Yokohama JPX), Vapor deposition apparatus.
  5. Shaw R. Howard (Palo Alto CA), Wafer support assembly.
  6. Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA), Wafer transfer system.

이 특허를 인용한 특허 (77)

  1. Lee, Yi-Lung, Ancillary apparatus and method for loading glass substrates into a bracket.
  2. Fishkin, Boris; Sherrard, Michael, Apparatus for cleaning and drying substrates.
  3. Takei Tetsuya (Ueno JPX), Apparatus for the formation of a functional deposited film using microwave plasma chemical vapor deposition process.
  4. Zejda Jaroslav (Rodenbach DEX), Cathode sputtering system.
  5. Huntley,Graeme; Bellenie,Neil Geoffrey, Combined vacuum pump load-lock assembly.
  6. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartmentalized substrate processing chamber.
  7. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartnetalized substrate processing chamber.
  8. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Conveying system for a vacuum processing apparatus.
  9. Ken Lee ; Ke Ling Lee ; Mingwei Jiang ; Robert M. Martinson, Horizontal sputtering system.
  10. Steiner Urs (Sunnyvale CA) Hurst James (San Jose CA) Schier J. Alan (Menlo Park CA), Inlet valve for probe apparatus.
  11. Yang, Tsun-Neng; Gunng, Tai-Cheng; Ma, Wei-Yang; Yang, Yu-Tang; Tsai, Ming-Ruesy; Lan, Kao-Chi, Ion implanting apparatus.
  12. Koji Masashi (Tokyo JPX), Photo-CVD apparatus.
  13. Bramhall ; Jr. Robert B. (Gloucester MA) Cloutier Richard M. (Salisbury MA), Platen assembly for a vacuum processing system.
  14. Reimer, Paul; Sabouri, Pedram; Smith, Dennis, Processing apparatus having integrated pumping system.
  15. Reimer,Peter; Sabouri,Pedram; Smith,Dennis R., Processing apparatus having integrated pumping system.
  16. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
  17. Wilkinson Thomas F. (Garland TX), Semiconductor wafer carrier design.
  18. Achkire, Younes; Lerner, Alexander N; Govzman, Boris; Fishkin, Boris; Sugarman, Michael N; Mavliev, Rashid A; Fang, Haoquan; Li, Shijian; Shirazi, Guy E; Tang, Jianshe, Single wafer dryer and drying methods.
  19. Achkire, Younes; Lerner, Alexander; Govzman, Boris T.; Fishkin, Boris; Sugarman, Michael; Mavliev, Rashid; Fang, Haoquan; Li, Shijian; Shirazi, Guy; Tang, Jianshe, Single wafer dryer and drying methods.
  20. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in a vaccum tank.
  21. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in vacuum tank.
  22. Lee Ke Ling ; Mazur Mikhail ; Lee Ken ; Martinson Robert M., System and method for handling and masking a substrate in a sputter deposition system.
  23. Strahl Thomas L. (Fremont CA) Lamont ; Jr. Lawrence T. (San Jose CA) Peterson Carl T. (Fremont CA) Brown Hobart A. (Santa Cruz CA) McCormick Lonnie W. (Cupertino CA) Mosely Roderick C. (Mountain View, System and method for processing workpieces.
  24. Ke Ling Lee ; Mikhail Mazur ; Ken Lee ; Robert M. Martinson, System and method for transporting and sputter coating a substrate in a sputter deposition system.
  25. Maher Joseph A. ; Vowles E. John ; Napoli Joseph D. ; Zafiropoulo Arthur W. ; Miller Mark W., System for processing substrates.
  26. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Transferring device for a vacuum processing apparatus and operating method therefor.
  27. Strasser Gregor (Vaduz LIX) Zhrer Gerald (Weite CHX) Schertler Roman (Wolfurt ATX) Fischer Heinrich (Triesen LIX), Transport system for conveying workpiece between first and second media.
  28. Bertram, Jr., Ronald Thomas; Arena, Chantal; Werkhoven, Christiaan J.; Tischler, Michael Albert; Vorsa, Vasil; Johnson, Andrew D., UV absorption based monitor and control of chloride gas stream.
  29. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  30. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  31. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method using a vacuum chamber.
  32. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method with wafers, substrates and/or semiconductors.
  33. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  34. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  35. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  36. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  37. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  38. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  39. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  40. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  41. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  42. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  43. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  44. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  45. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  46. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  47. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  48. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  49. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  50. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  51. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  52. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  53. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  54. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  55. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  56. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  57. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  58. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  59. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  60. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  61. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  62. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  63. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  64. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  65. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  66. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  67. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  68. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  69. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  70. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing equipment configuration.
  71. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing equipment configuration.
  72. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  73. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  74. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  75. Schofield, Nigel Paul, Vacuum pumping system and method of operating a vacuum pumping arrangement.
  76. Weinberg Richard S. (Palo Alto CA), Vacuum vessel.
  77. Dimock Jack A. (Santa Barbara CA) Woestenburg Dirk P. (Summerland CA), Wafer processing machine with evacuated wafer transporting and storage system.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로