[특허]Automatic plasma processing device and heat treatment device

Tokyo Denshi Kagaku Kabushiki Kaisha

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특허 상세정보

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내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Automatic plasma processing device and heat treatment device

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B23K-009/00 C23C-015/00
미국특허분류(USC)	219/121.PG; 219/121.PD; 219/121.PX; 156/345; 414/217; 414/331; 414/404
출원번호	US-0424503 (1982-09-27)
우선권정보	JP-0159281 (1981-10-05); JP-0148583 (1982-08-27)
발명자 / 주소	Uehara, Akira Hijikata, Isamu Nakane, Hisashi Nakayama, Muneo
출원인 / 주소	Tokyo Denshi Kagaku Kabushiki Kaisha
대리인 / 주소	Weiner, Irving M.Carrier, Joseph P.Cantarella, John J.
인용정보	피인용 횟수 : 27 인용 특허 : 8

초록
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An automatic plasma processing device having a substantially vertically disposed plasma chamber in which a plurality of semiconductor wafers can be simultaneously processed with plasma. The automatic plasma processing device comprises a container cassette adapted to contain a plurality of wafers therein, a feeding mechanism for taking out the wafers one by one from the cassette and for feeding the same, a holding frame for receiving the wafers one by one from the feeding mechanism and for holding the same therein, a driving mechanism for moving the holding frame up and down into and out of the plasma chamber, a plasma generating mechanism for generating plasma in the plasma chamber, and a control system for controlling the aforesaid mechanisms. The device is simplified in construction and can automatically and successively process a large number of wafers, while at the same time having a compact construction.

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1. An automatic plasma processing device, comprising: at least one cassette member adapted to contain a plurality of semiconductor wafers therein; feeding means for taking out said wafers one by one from said cassette member and for feeding the same; a holding member operable for receiving said wafers one by one from said feeding means and for holding a plurality of said wafers therein in a predetermined spaced relation in substantially the vertical direction, with each said wafer being disposed horizontally; said holding member including a bottom plate, and a plurality of substantially vertical bars each having a lower portion thereof fixed to said bottom plate and grooves or slits formed in a vertical column therein, such that associated sets of grooves of said vertical bars may each receive therein peripheral portions of a wafer; driving means for driving said holding member to move in a substantially vertical direction; a plasma chamber disposed in a substantially vertical direction such that said holding member may be moved substantially in the vertical direction into and out of said plasma chamber; plasma generating means for generating plasma in said plasma chamber in order to effect plasma processing of said wafers with the plasma generated thereby; and control means for controlling said feeding means, said driving means and said plasma generating means in accordance with a predetermined sequence. 2. An automatic plasma processing device according to claim 1, wherein: said feeding means is also operable to take said wafers after completion of the processing one by one from said holding member and to feed said wafers back to said cassette member one by one. 3. An automatic plasma processing device according to claim 1 or 2, wherein: said feeding means includes at least one first feeding mechanism for receiving said wafers from and delivering said wafers to said cassette member, and a second feeding mechanism for receiving said wafers from and delivering said wafers to said first feeding mechanism and said holding member. 4. An automatic plasma processing device according to claim 3, wherein: said cassette member includes a pair of substantially vertical parallel plates fixed relative to each other; a plurality of ribs are formed in a predetermined spaced relationship in a substantially vertical direction on each of opposing ones of surfaces of said parallel plates such that a wafer may be received at peripheral portions thereof on opposing ones of said ribs of said parallel plates; and said first feeding mechanism includes a lifting mechanism for positioning said cassette member substantially in the vertical direction, and a conveyor mechanism extending between said parallel plates of said cassette member. 5. An automatic plasma processing device according to claim 4, wherein: at least one pair of said cassette members is provided; and at least one pair of said feeding mechanisms is provided, each operable for receiving said wafers from and delivering said wafers to either one of said cassette members and for individually receiving said wafers from and delivering said wafers to said second feeding mechanism. 6. An automatic plasma processing device according to claim 3, wherein: said second feeding mechanism includes: a substantially vertically movable member having an elongated horizontal top face which has one end disposed adjacent said first feeding mechanism and the opposite end opposed to said holding member; a lifting mechanism operable for positioning said vertically movable member substantially in the vertical direction; a pair of conveyor mechanisms mounted on opposite sides of said horizontal top face of said vertically movable member and operatively cooperative to feed a wafer in a substantially horizontal direction; a pair of substantially horizontally movable members disposed on opposite sides of said horizontal top face of said vertically movable member and operatively cooperative to hold a wafer thereon and reciprocally movable to said holding member; and a driving mechanism operable to position said horizontally movable member substantially in the horizontal direction. 7. An automatic plasma processing device according to claim 3, wherein: said second feeding mechanism feeds a wafer into said holding member in a substantially horizontal direction; said plurality of vertical bars comprises four substantially vertical parallel bars having lower ends thereof fixed to said bottom plate; and each said associated set of grooves comprises four associated grooves of said four parallel bars. 8. An automatic plasma processing device according to claim 7, wherein: a pair of said four parallel bars are disposed adjacent said second feeding mechanism and are spaced from each other by a relatively great distance while the other pair of said four parallel bars are disposed remote from said second feeding mechanism and are spaced from each other by a relatively small distance. 9. An automatic plasma processing device according to claim 7, wherein: said plasma chamber has an opening which is open downwardly; and said bottom plate of said holding member is operable to close said opening of said plasma chamber. 10. An automatic plasma processing device according to claim 1, wherein: said plasma chamber is substantially in the form of a cylinder which has a substantially vertical axis. 11. An automatic plasma processing device according to claim 1, further comprising: heating means for heating said plasma chamber from the outside, said heating means being controlled by said control means. 12. A heat treatment device, comprising: at least one cassette member adapted to contain therein a plurality of thin plate-like works to be treated; feeding means for taking out said works one by one from said cassette member and for feeding the same; a holding member operable for receiving said works one by one from said feeding means and for holding therein a plurality of said works in a predetermined spaced relation in substantially the vertical direction, with each said work being disposed horizontally; driving means for driving said holding member to move in a substantially vertical direction; a heat treatment chamber disposed in a substantially vertical direction such that said holding member may be moved in the vertical direction into and out of said heat treatment chamber; said heat treatment chamber being adapted for a treatment including at least the heating of said works; and heating means for heating said heat treatment chamber from the outside. 13. An automatic heat treatment device for sheet-like treatment objects, comprising: a treatment chamber disposed such that an axis thereof extends in a substantially vertical direction; heating means disposed on an outer periphery of said treatment chamber; and a holding member for holding a plurality of said sheet-like treatment objects in a predetermined spaced relation in a substantially vertical column with each said object being disposed horizontally, said holding member being adapted to move in substantially a vertical direction between a first predetermined position in which said objects are loaded therein and unloaded therefrom, and a second predetermined position in which said objects are heat-treated in said treatment chamber. 14. An automatic heat treatment device according to claim 13, wherein: said heating means comprises a high-frequency inductive heating coil. 15. An automatic heat treatment device according to claim 13, wherein: said heating means comprises a resistance heating coil. 16. An automatic heat treatment device according to claim 13, wherein: said heating means comprises a heating lamp. 17. An automatic heat treatment device according to claim 13, wherein: said treatment chamber is substantially cylindrical and opening downwardly; and said holding member is moved substantially in the vertical direction into and out of said treatment chamber through said opening.

이 특허에 인용된 특허 (8)

이 특허를 인용한 특허 피인용횟수: 27

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Automatic plasma processing device and heat treatment device

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Automatic plasma processing device and heat treatment device

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이 특허에 인용된 특허 (8)

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