초록 ▼

A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover por

A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41). In yet another embodiment, a carrier apparatus (100) for mounting logic components on the surface of a circuit board (41) is disclosed which utilize ground and voltage planes together with alternating signal (118) and AC ground (121) traces so as to effectuate coplanar/strip-line and coplanar/microstrip transmission line environments along portions of the signal traces (118). Consequently, this results in signal lines having a controlled impedance environment and minimized crosstalk between neighboring signal leads lying in the same plane.

대표청구항 ▼

1. A carrier apparatus for mounting logic components on a mounting surface having electrical pathways such as a circuit board, comprising: (a) a housing defining top and bottom surfaces, said housing further having a cavity for receipt of a logic component; (b) lid means for enclosing said cavit

1. A carrier apparatus for mounting logic components on a mounting surface having electrical pathways such as a circuit board, comprising: (a) a housing defining top and bottom surfaces, said housing further having a cavity for receipt of a logic component; (b) lid means for enclosing said cavity; (c) a plurality of electrical pathways positioned within said housing, said electrical pathways being positioned on at least two vertically spaced apart horizontal planes within said housing so as to have a "co-planar" arrangement on each of said horizontal planes, said electrical pathways further being horizontally spaced apart from one another and configured to minimize parasitic inductance and capacitance of individual electrical pathways, said electrical pathways being embedded between spaced apart planes selected from voltage and ground planes, said electrical pathways cooperating with said planes to provide a transmission line environment along said electrical pathways; (d) vertically extending means for electrically interconnecting said electrical pathways in said housing with the electrical pathways on said mounting surface, said vertically extending means including vertically extending signal means configured to cooperate with corresponding vertically extending ground means spaced apart from said vertically extending signal means and extending substantially parallel to said vertically extending signal means, said vertically extending signal means and said vertically extending ground means cooperating to provide a transmission line like environment along said vertically extending signal means wherein said vertically extending signal means display a controlled impedance; and (e) means for structurally attaching the carrier apparatus to said mounting surface. 2. A carrier apparatus in accordance with claim 1, wherein said vertically extending means include VIA means, one end of each of said VIA means projecting a predetermined distance beyond said housing, said ends lying substantially in a horizontal plane, thereby providing for interconnection of said VIA means to said mounting surface. 3. A carrier apparatus in accordance with claim 1, wherein said vertically extending means are arranged in rows generally parallel to the edge of said housing, said vertically extending means in adjacent rows being staggered or offset from one another such that elements of adjacent rows do not lie in the same column. 4. A carrier apparatus in accordance with claim 2, wherein said ends of said VIA means have a right circular conical shape, said ends providing for attachment to the mounting surface. 5. A carrier apparatus for mounting logic components on the surface of a circuit board, comprising: (a) a housing structure having first and second major surfaces, said housing structure having a cavity extending from one of said major surfaces into said housing, said cavity adapted for receipt of a logic component; (b) a lid portion for hermetically sealing the component in said cavity; (c) electrical leads extending horizontally from said cavity toward the periphery of said housing, said electrical leads being arranged in a predetermined spatial coplanar configuration, said electrical leads including alternating signal and ground leads so as to minimize cross talk between adjacent signal leads, a first portion of said signal leads being covered by said lid portion, a second portion of said signal leads being not covered by said lid portion, said electrical leads also being at least partially positioned between overlying and underlying spaced apart planes selected from ground and voltage planes, said planes being positioned substantially parallel to said electrical leads, said planes cooperating with said alternating signal and ground leads to provide a transmission line environment along said signal leads; (d) means for mounting said housing on the circuit board with said lid portion facing the circuit board; and (e) vertically extending signal VIA means electrically interconnecting at least some of said signal leads to corresponding leads on the circuit board, said signal VIA means cooperating with ground VIA means interconnected to ground to provide a transmission line environment along said signal VIA means exhibiting controlled impedance. 6. A carrier apparatus in accordance with claim 5, wherein said lid portion is electrically conducting. 7. A carrier apparatus in accordance with claim 5, wherein said lid portion is made from a dielectric material. 8. A carrier apparatus in accordance with claim 5, wherein adjacent spaced apart planes selected from ground and voltage planes are interconnected by vertically extending ground VIA means thereby providing impedance continuity between said vertically spaced apart planes. 9. A carrier apparatus in accordance with claim 8, wherein said ground VIA means interconnecting said spaced apart planes are positioned adjacent to corresponding signal VIA means. 10. A carrier apparatus in accordance with claim 5, wherein said coplanar ground leads are electrically interconnected by vertically extending VIA means to said underlying and overlying planes, said VIA means being positioned along said coplanar ground leads at frequent intervals. 11. A carrier apparatus in accordance with claim 5, wherein said ground VIA means cooperating with said signal VIA means to provide a transmission line environment along said signal VIA means are separate from and extend parallel to said signal VIA means. 12. A carrier apparatus in accordance with claim 5, wherein said ground VIA means and said signal VIA means cooperating with one another to provide a transmission line environment along said signal VIA means include a single elongated VIA structure having first and second electrically conducting portions electrically isolated from one another by a dielectric material. 13. A carrier apparatus in accordance with claim 5, wherein decoupling capacitors are positioned within cavities of said housing adjacent to said logic component cavity. 14. A carrier apparatus in accordance with claim 13, wherein said decoupling capacitors are symmetrically distributed throughout said housing. 15. A carrier apparatus for mounting logic components on the surface of a circuit board, comprising: (a) a housing having first and second oppositely facing major surfaces and having a cavity extending from said first major surface into said housing for receipt of a logic component; (b) lid means for enclosing said cavity; (c) a plurality of alternating, spaced apart signal leads and ground leads arranged in a planar fashion, said signal leads including input and output signal leads extending from said cavity toward the periphery of said housing, said input signal leads having a lesser width than said output signal leads, whereby said input signal leads have a higher transmission line characteristic impedance than said output signal leads; (d) means for electrically interconnecting said signal leads to corresponding leads on a circuit board; (e) termination means positioned on the carrier apparatus for providing selective termination of said input signal leads with a matching impedance, said termination means including vertically extending VIA means embedded in said housing and surface metalization means disposed on said second major surface, said termination means being necessarily positioned on said housing in close electrical proximity to said logic component and necessarily accessible after the logic component has been positioned in said housing to enable selective termination of said signal leads with their characteristic impedance as required, thereby eliminating voltage reflection on said input signal leads; and (f) said signal leads and ground leads being positioned between spaced apart, planes selected from voltage and ground planes extending parallel to said signal leads and ground leads, said signal leads and said ground leads cooperating with said planes to provide a transmission line environment along said signal leads. 16. A carrier apparatus in accordance with claim 15, wherein said input signal leads include a termination resistor to provide termination of said input signal leads with a matching impedance, thereby eliminating voltage reflection or wavefronts on said input signal leads. 17. A carrier apparatus in accordance with claim 15, wherein the carrier apparatus includes mounting means for mounting the carrier apparatus on the circuit board with said lid means facing toward the circuit board such that the carrier apparatus is mounted in a lid down configuration. 18. A carrier apparatus in accordance with claim 15, wherein the carrier apparatus provides for cooling of the logic component with cooling means separate from and independent of the circuit board, whereby said cooling means is not integral with nor embedded in the circuit board. 19. A carrier apparatus in accordance with claim 18, wherein the carrier apparatus includes a metalized relatively flat region positioned on said second major surface of the carrier apparatus facing away from the circuit board. 20. A carrier apparatus in accordance with claim 5, wherein said vertically extending signal VIA means and said vertically extending ground VIA means include a single elongated, vertically extending VIA member of dielectric material having two outer separate, spaced apart metal layers each having a semicircular cross section, one of the metal layers being connected to a ground and the other being connected to one of the signal leads. 21. A carrier apparatus in accordance with claim 5, wherein said vertically extending VIA means and said vertically extending ground VIA means comprise spaced apart vertically extending, electrically conducting VIA members cooperating with each other to provide a transmission line environment.