초록 ▼

An internally cooled semiconductor package including a wafer-like semiconductor body with at least two electrical elements, one at a relatively flat surface of the body. A wall of high electrical and heat conductive material abuts the flat surface of the semiconductor body to be in good heat conduct

An internally cooled semiconductor package including a wafer-like semiconductor body with at least two electrical elements, one at a relatively flat surface of the body. A wall of high electrical and heat conductive material abuts the flat surface of the semiconductor body to be in good heat conductive relation therewith and in electrical contact with the same. A fluid flow heat exchanger is on the other side of the wall in heat exchange relation therewith and along with the wall and other components serves to encapsulate the semiconductor.

대표청구항 ▼

1. A semiconductor package with internal heat exchanger comprising: a wafer-like semiconductor body having at least two electrical elements; one at a relatively flat surface of said body; a wall of high electrical and heat conductive material, said wall having one side in substantial abutment wi

1. A semiconductor package with internal heat exchanger comprising: a wafer-like semiconductor body having at least two electrical elements; one at a relatively flat surface of said body; a wall of high electrical and heat conductive material, said wall having one side in substantial abutment with said flat surface of said body to be in heat conductive relation therewith and in electrical contact with said one of said elements; a fluid flow heat exchanger on the other side of said wall in heat exchange relation therewith; and means including said wall and encapsulating said body, there being two said walls in spaced relation, each forming a fluid boundry of said heat exchanger, and there being two said bodies, each in substantial abutment with a respective wall, and a pair of electrically conductive means sandwiching each said body against the respective wall and forming part of said encapsulating means; said heat exchanger being comprised of a series of plates sandwiched by said walls, said series including a central distribution plate and alternating apertured and baffle plates on each side thereof. 2. The semiconductor package of claim 1 wherein said encapsulating means further comprise a pair of electrically insulating rings, each surrounding the periphery of an associated one of said bodies and interposed between the associated electrically conductive means and walls to define encapsulating spaces for said bodies. 3. The semiconductor package of claim 1 wherein the apertures in each said apertured plates are staggered with respect to the apertures in the adjacent apertured plates. 4. The semiconductor package of claim 1 wherein each of said plates include aligned solid portions separating flow paths therethrough and said portions are in abutment with each other, and said plates are of a thermally conductive material to facilitate heat transfer from said walls to the interior of said heat exchanger.