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Connector with component removal means 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/00
  • H01R-013/62
출원번호 US-0548137 (1983-11-02)
우선권정보 JP-0040953 (1983-03-22)
발명자 / 주소
  • Egawa, Yoshinori
출원인 / 주소
  • Yamaichi Electric Mfg. Co., Ltd.
대리인 / 주소
    Wenderoth, Lind & Ponack
인용정보 피인용 횟수 : 61  인용 특허 : 2

초록

An IC socket with a mechanism for removing an IC package mounted therein and which has terminals to be brought into contact with terminals of the IC socket, the IC socket has a socket body with terminals around a package receiving recess to receive terminals of the IC package, a cover pivotally atta

대표청구항

1. An IC socket with means for removing an IC package mounted therein and which has terminals to be brought into contact with terminals of the IC socket, said IC socket comprising: a socket body having a recess therein for receiving the IC package and having terminals therearound with which the t

이 특허에 인용된 특허 (2)

  1. Brown Vincent B. (Prospect Heights IL) Schlacks Robert F. (Mount Prospect IL), Cover for chip carrier socket.
  2. Rognon Robert Y. (P. O. Box 829 White Mountain Lake AZ 85912), Double suction cup holder with vacuum control valve.

이 특허를 인용한 특허 (61)

  1. Bumb ; Jr. Frank E. ; Gates Geoffrey W. ; Good David C., Apparatus and method for testing a device.
  2. Hembree,David R., Articles of manufacture and wafer processing apparatuses.
  3. Cedrone Nicholas J. (Wellesley Hills MA), Broad band contactor assembly for testing integrated circuit devices.
  4. Gussman Robert L. (Houston TX), Burn-in board for use with automated unloader.
  5. Margalit, Yanki; Margalit, Dany, Cable apparatus.
  6. Liken Peter A. (West Olive MI) Ensing Steven B. (Holland MI), Carrier for use in testing circuit boards.
  7. Lai,Chih Ming, Chip adapter seat.
  8. Khadem Gita ; Holt George Thomas, Circuit board component retainer and extractor.
  9. Beck, John P., Compliant actuator for IC test fixtures.
  10. Takahashi,Takeshi, Connector easily adapted to miniaturization.
  11. Cedrone Nicholas J. (Wellesely Hills MA), Contactor assembly for testing integrated circuits.
  12. Slye Bradley D. (Golden Valley MN) Johnson David A. (Minneapolis MN), Decoupling apparatus for use with integrated circuit tester.
  13. Liao,Fang Jwu; Szu,Ming Lun, Electrical connector assembly with pick up cap.
  14. Ma, Hao-Yun, Electrical connector assembly with rotatably assembled pick up cap.
  15. Bright Edward J. (Middletown PA) Consoli John J. (Harrisburg PA) Taylor Attalee S. (Palmyra PA), Electrical socket for TAB IC\s.
  16. Hembree David R., Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus.
  17. Akram, Salman; Hembree, David R., Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece.
  18. Akram, Salman; Hembree, David R., Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece.
  19. Ju,Ted, Fastening structure and an electrical connector using the fastening structure.
  20. Kelley Mark P. ; Bobrov Yakov A., Frame for holding a bladed element of an IC handling system.
  21. Mellen,Christopher M.; Henry,Louis F., Grater with suction device.
  22. Schaff Robert J., Housing for surface mountable device packages.
  23. Osato, Eichi; Kasai, Junichi; Meguro, Kouichi; Onodera, Masanori, IC carrie, IC socket and method for testing IC device.
  24. Matsuoka Noriyuki (Tokyo JPX), IC socket.
  25. Matsuoka Noriyuki (Tokyo JPX) Ishida Junji (Tokyo JPX), IC socket.
  26. Tae,Gi hyun; Sung,Ki hyub, Information processing apparatus having a mounting slot and mounting slot door thereof.
  27. Stowers Jeffery P. ; Blackard Paul D. ; Garman Randall Clark, Interface system utilizing engagement mechanism.
  28. Ma, Hao-Yun; Szu, Ming-Lun, Land grid array connector assembly having a stiffener with pivot bores.
  29. Chiang,Chun Hsiang, Latch device for socket connector.
  30. Mellen,Christopher M.; Henry,Louis F., Mandoline slicer with suction devices.
  31. Wood,Alan G.; Corbett,Tim J., Method for testing using a universal wafer carrier for wafer level die burn-in.
  32. Wood,Alan G.; Corbett,Tim J., Method for testing using a universal wafer carrier for wafer level die burn-in.
  33. Wood,Alan G.; Corbett,Tim J., Method for testing using a universal wafer carrier for wafer level die burn-in.
  34. Wood,Alan G.; Corbett,Tim J., Method for testing using a universal wafer carrier for wafer level die burn-in.
  35. Wood,Alan G.; Corbett,Tim J., Method for testing using a universal wafer carrier for wafer level die burn-in.
  36. Wood,Alan G.; Corbett,Tim J., Method for testing using a universal wafer carrier for wafer level die burn-in.
  37. Kinsman,Larry; Brooks,Mike; Farnworth,Warren M.; Moden,Walter; Lee,Terry, Methods for installing a circuit device.
  38. Kinsman, Larry; Brooks, Mike; Farnworth, Warren M.; Moden, Walter; Lee, Terry, Methods for installing a plurality of circuit devices.
  39. Hembree,David R., Methods of processing a workpiece, methods of communicating signals with respect to a wafer, and methods of communicating signals within a workpiece processing apparatus.
  40. Akram,Salman; Hembree,David R., Methods of sensing temperature of an electronic device workpiece.
  41. Stowers Jeffrey P. (Stanton VA) Blackard Paul D. (Waynesborok VA) Garman Randall C. (Waynesboro VA), Micro interface technology system utilizing slide engagement mechanism.
  42. Mellen,Christopher M.; Henry,Louis F.; Paradise,Charles S., Mixing bowl.
  43. Murphy James V. (Warwick RI) Murphy Michael J. (East Greenwich RI), Molded-in lead frames.
  44. Ma,Hao Yun; Szu,Ming Lun, Pick up cap for LGA connector assembly.
  45. Burgers Henri T. ; Stowers Jeffery P. ; Garman Randall Clark, Rapid action engagement interface connection system.
  46. Mellen,Christopher M.; Henry,Louis F.; Paradise,Charles S., Round mixing bowl.
  47. Mellen,Christopher M.; Henry,Louis F.; Paradise,Charles S., Salad spinner with suction device.
  48. Farnworth, Warren M.; Kinsman, Larry D.; Moden, Walter L., Semiconductor device socket.
  49. Farnworth Warren M. ; Kinsman Larry D. ; Moden Walter L., Semiconductor device socket, assembly and methods.
  50. Farnworth Warren M. ; Kinsman Larry D. ; Moden Walter L., Semiconductor device socket, assembly and methods.
  51. Farnworth Warren M. ; Kinsman Larry D. ; Moden Walter L., Semiconductor device socket, assembly and methods.
  52. Warren M. Farnworth ; Larry D. Kinsman ; Walter L. Moden, Semiconductor device socket, assembly and methods.
  53. Warren M. Farnworth ; Alan G. Wood ; Trung Tri Doan ; David R. Hembree, Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect.
  54. Hashimoto,Shinichi, Suction cap for IC sockets and IC socket assembly using same.
  55. Paradise, Charles S.; Henry, Louis F., Suction device and bases for kitchenware, small appliances, and other applications.
  56. Wood,Alan G.; Corbett,Tim J., Universal wafer carrier for wafer level die burn-in.
  57. Wood,Alan G.; Corbett,Tim J., Universal wafer carrier for wafer level die burn-in.
  58. Wood,Alan G.; Corbett,Tim J.; Farnworth,Warren M., Universal wafer carrier for wafer level die burn-in.
  59. Hembree, David R., Wafer processing apparatuses and electronic device workpiece processing apparatuses.
  60. Takamine Henry K. (Gardena CA), X-band logic test jig.
  61. Walkup William B. (Huntington CT), Zero separation force connector with wiping insertion.
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