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Cooling system for VLSI circuit chips

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0630031 (1984-07-12)
발명자 / 주소
  • Eastman, Dean E.
  • Eldridge, Jerome M.
  • Petersen, Kurt E.
  • Olive, Graham
출원인 / 주소
  • IBM Corporation
대리인 / 주소
    Ohlandt, John F.
인용정보 피인용 횟수 : 105  인용 특허 : 4

초록

A system for cooling integrated circuit chips and particularly those involving very large scale integrated circuits; the system provides for closely associating the heat-sink or heat exchange element with the integrated circuit chip by having the heat-sink, in the form of a "cooling chip", in intima

대표청구항

1. A system cooling an integrated circuit chip comprising: (a) a heat-sink having one surface in intimate contact with the back surface of said integrated circuit chip, the front surface thereof making contact with a carrier for said integrated circuit chip; (b) said heat-sink including a semico

이 특허에 인용된 특허 (4)

  1. Kay George (Anaheim CA) Keskinen Alan (Van Nuys CA), Disc-reel sound suppressor.
  2. Meeker Robert G. (La Grangeville NY) Scanlon William J. (Hopewell Junction NY) Segal Zvi (Wappingers Falls NY), Gas encapsulated cooling module.
  3. Bland Timothy J. (Rockford IL) Niggemann Richard E. (Rockford IL), Impingement cooling apparatus for heat liberating device.
  4. Lavender ; Ardis R., Plate type fluid distributing device.

이 특허를 인용한 특허 (105)

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