IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0630031
(1984-07-12)
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발명자
/ 주소 |
- Eastman, Dean E.
- Eldridge, Jerome M.
- Petersen, Kurt E.
- Olive, Graham
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
105 인용 특허 :
4 |
초록
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A system for cooling integrated circuit chips and particularly those involving very large scale integrated circuits; the system provides for closely associating the heat-sink or heat exchange element with the integrated circuit chip by having the heat-sink, in the form of a "cooling chip", in intima
A system for cooling integrated circuit chips and particularly those involving very large scale integrated circuits; the system provides for closely associating the heat-sink or heat exchange element with the integrated circuit chip by having the heat-sink, in the form of a "cooling chip", in intimate contact with the back surface of an integrated circuit chip (in a "flip chip" configuration, the front, or circuit-implemented, surface, makes contact with a ceramic carrier or module); the cooling chip is provided with a plurality of spaced parallel grooves which extend along the one side or surface opposite the surface that is in bearing contact with the integrated circuit chip, whereby liquid coolant flows through the grooves so as to remove heat from the integrated circuit chip; further included in the system is a specially configured bellows for conducting the liquid coolant from a source to the heat-sink, and for removing the liquid coolant; a coolant distribution means, in the form of at least one glass plate or manifold, is provided with spaced passageways interconnecting the respective incoming and outgoing coolant flow paths of the bellows with the heat-sink.
대표청구항
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1. A system cooling an integrated circuit chip comprising: (a) a heat-sink having one surface in intimate contact with the back surface of said integrated circuit chip, the front surface thereof making contact with a carrier for said integrated circuit chip; (b) said heat-sink including a semico
1. A system cooling an integrated circuit chip comprising: (a) a heat-sink having one surface in intimate contact with the back surface of said integrated circuit chip, the front surface thereof making contact with a carrier for said integrated circuit chip; (b) said heat-sink including a semiconductor plate having a plurality of spaced parallel grooves, which grooves extend along the surface opposite said one surface, for conducting liquid coolant so as to remove heat from said integrated circuit chip; (c) a bellows including a first flexible member defining a flow path for said liquid coolant to said heat-sink; a second coaxial flexible member defining with said first member an annular flow path for said liquid coolant from said heat-sink; (d) a coolant distribution means having spaced passageways for interconnecting the respective flow paths of said bellows to spaced points on said grooves of said heat-sink, said coolant distribution means being in stacked relationship with said heat-sink. 2. A system as defined in claim 1 in which said coolant distribution means includes (1) an interconnection element; (2) a channel element, which has its upper surface in intimate contact with the lower surface of said interconnection element and its lower surface in intimate contact with the upper surface of said heat-sink, (3) said passageways being defined by spaced channels in said channel element interconnecting with corresponding ducts in said interconnection element, said ducts terminating in inlet and outlet ports. 3. A system as defined in claim 1, in which said spaced points are located at opposite ends of said grooves and at the midpoint of said grooves, whereby each groove is divided into two halves for flow of the liquid coolant in opposite directions therethrough. 4. A system as defined in claim 3, in which said midpoint is connected to the incoming flow of liquid coolant and said end points are connected to the outgoing flow of liquid coolant. 5. A system as defined in claim 4 in which all of said grooves are connected hydraulically in parallel. 6. A system as defined in claim 2, in which said spaced channels in said channel element include a centrally located channel and side channels on either side thereof, pairs of said corresponding ducts in said interconnection element having portions overlying the opposite ends of said respective side channels. 7. A system as defined in claim 6, in which a single inlet port communicates with said flow path for the liquid coolant to said heat-sink, and said outlet ports communicate with said annular flow path. 8. A system as defined in claim 7, in which a duct extends from said inlet port to communicate with the centrally located channel in said channel element. 9. A system cooling an integrated circuit chip comprising: (a) a heat-sink having one surface in intimate contact with a back surface of said integrated circit chip, the front surface thereof making contact with a carrier for said integrated circuit chip; (b) said heat-sink including a semiconductor plate having a plurality of spaced parallel grooves, which grooves extend along the surface opposite said one surface and said grooves not extending through said heat-sink, for conducting liquid coolant so as to remove heat from said integrated circuit chip; (c) a coolant distribution means having spaced passageways for interconnecting oppositely directed first and second flow paths for liquid coolant to spaced points on said grooves of said heat-sink, said coolant distribution means further including 1. an interconnection element; 2. a channel element, which has its upper surface contacting said interconnection element and its lower surface in intimate contact with the upper surface of said heat-sink; 3. said passageways being defined by spaced channels in said channel element interconnecting with corresponding ducts in said interconnection element, said ducts terminating in inlet and outlet ports at the upper surface of said interconnection element. 10. A system as defined in claim 9, in which said spaced points are located at opposite ends of said grooves and at the midpoint of said grooves, whereby each groove is divided into two halves for flow of the liquid coolant in opposite directions therethrough. 11. A system as defined in claim 10, in which said midpoint is connected to the incoming flow of liquid coolant and said end points are connected to the outgoing flow of liquid coolant. 12. A system as defined in claim 11, in which all of the grooves are connected hydraulically in parallel. 13. A system as defined in claim 9, in which said spaced channels in said channel element include a centrally located channel and side channels on either side thereof, pairs of said corresponding ducts in said interconnection element having portions overlying the opposite ends of said respective side channels. 14. A system as defined in claim 13, in which a single inlet port communicates with said first flow path for the liquid coolant to said heat-sink, and said outlet ports communicate with said second flow path from said heat-sink. 15. A system as defined in claim 14, in which a duct extends from said inlet port to communicate with the centrally located channel in said channel element. 16. A system cooling an integrated circuit chip comprising: a heat exchange element having a plurality of grooves extending across one side thereof and not extending through said element for conducting liquid coolant so as to remove heat from said integrated circuit chip, the other side of said heat exchange element being in intimate contact with the back side of said integrated circuit chip; coolant distribution means having at least one inlet port and one output port disposed on one side thereof, and at least one inlet and a plurality of output channel openings disposed on the other side thereof, said at least one inlet channel opening and said plurality of output channel openings being disposed over and accessing a portion of each of said grooves and forming a plurality of coolant flow paths along each of said grooves, said inlet and output ports being connected to said respective inlet channel opening and said plurality of output channel openings. 17. A system for cooling an integrated circuit according to claim 16 wherein said coolant distribution means includes an interconnection element and a channel element, said interconnection element including ducts which extend through said interconnection element and register at one end thereof with said at least one inlet and output ports, said channel element including distributor passages which extend through said channel element and on one side thereof intercept said ducts and on the other side thereof terminate and register with said inlet and output channel openings.
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