초록

Described herein is a composition which contains bis(2,3-epoxycyclopentyl) ether, a specific group of hardeners and a specific group of thermoplastics. When cured, these compositions have improved tensile properties as compared to similar compositions which do not contain thermoplastics.

대표청구항 ▼

A thermoplastic modified epoxy composition comprising: (a) a bis(2,3-epoxycyclopentyl)ether. (b) a diamine hardener selected from one or more of 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl methane, 3,3′-diaminodiphenyl methane, 4,4′-diaminodiphenyl sulfone, 3,3′-diaminodiphenyl sulfone, 3,3′-di

A thermoplastic modified epoxy composition comprising: (a) a bis(2,3-epoxycyclopentyl)ether. (b) a diamine hardener selected from one or more of 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl methane, 3,3′-diaminodiphenyl methane, 4,4′-diaminodiphenyl sulfone, 3,3′-diaminodiphenyl sulfone, 3,3′-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenyl sulfide, 1,4-bis(p-aminophenoxy)benzene, 1,4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy)benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4,4-diaminodiphenyl sulfone, and (c) a thermoplastic selected from one or more of the following: polycaprolactone, polyetherimide, phenoxy, polyarylether of the formula: [Figure] wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4′-biphenol, a is 1, b is 1 or greater, and c is 5 to 100.