초록 ▼

A process for the production of transparent, electrically conductive, infrared-reflecting indium oxide-tin oxide layers, especially on glass panes, involves steps wherein the glass panes are dipped into a first solution containing a hydrolyzable silicon compound and hydrolyzable compounds of titaniu

A process for the production of transparent, electrically conductive, infrared-reflecting indium oxide-tin oxide layers, especially on glass panes, involves steps wherein the glass panes are dipped into a first solution containing a hydrolyzable silicon compound and hydrolyzable compounds of titanium, zirconium, aluminum, tin or tantalum; the glass panes are heated up to 450°C. in a moisture-containing atmosphere; the initially coated panes are dipped into a second solution containing hydrolyzable compounds of indium and of tin; the panes are dried at temperatures below 250°C.; and the panes are finally heated up to 550°C. in a reducing atmosphere.

대표청구항 ▼

A process for the production of transparent, electrically conductive, infrared-reflecting indium oxide-tin oxide layers on a substrate, comprising, (a) dipping the substrate into a first solution containing a hydrolyzable silicon compound and a hydrolyzable compound of titanium, zirconium, aluminum,

A process for the production of transparent, electrically conductive, infrared-reflecting indium oxide-tin oxide layers on a substrate, comprising, (a) dipping the substrate into a first solution containing a hydrolyzable silicon compound and a hydrolyzable compound of titanium, zirconium, aluminum, tin, tantalum, or a mixture thereof; (b) uniformly drawing the substrate out from the first solution into a moisture-containing atmosphere; (c) heating it at a temperature of up to 450°C. which is effective to dry and harden the resultant layer deposited on the substrate; (d) dipping the initially coated substrate into a second solution contaning a hydrolyzable compound of indium and a hydrolyzable compound of tin; (e) uniformly drawing the substrate out from the second solution into a moisture-containing atmosphere; (f) heating the substrate at a temperature up to 550°C. in a reducing atmosphere containing steam and 0 to 3 vol-% of oxygen, the temperature being effective to essentially fully dry and harden the layer deposited in step (e) and effect a reduction thereof via the reducing atmosphere.