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Electrically conductive thermoplastic resin composition containing metal and carbon fibers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08L-007/02
  • H01B-001/20
출원번호 US-0597605 (1984-04-06)
우선권정보 JP-0063007 (1983-04-12)
발명자 / 주소
  • Deguchi Ryuichi (Ube JPX)
출원인 / 주소
  • Ube Industries, Ltd. (Yamaguchi JPX 03)
인용정보 피인용 횟수 : 53  인용 특허 : 2

초록

An electrically conductive thermoplastic resin composition having a high electrical conductivity and a relatively low specific gravity is obtained by evenly dispersing 2% by volume or more of metallic fibers and 2% by volume or more carbon fibers in a thermoplastic resin matrix, the sum of the amoun

대표청구항

An electrically conductive thermoplastic resin composition which comprises: a matrix comprising a thermoplastic resin consisting essentially of at least one member selected from the group consisting of polyolefins, polyamides, acrylonitrile-styrene copolymer resins, acrylonitrile-styrene-butadiene t

이 특허에 인용된 특허 (2)

  1. Kanda Masahiro (Kanagawa JPX) Hatakeyama Tetsuya (Saitama JPX) Morito Yusuke (Kanagawa JPX), Electromagnetic wave-shielding materials.
  2. Abolins Visvaldis (Delmar NY) Bopp Richard C. (Ballston Lake NY) Caraher Joel M. (Pattersonville NY) Lovgren Eric M. (Westerlo NY), Polyphenylene ether resin compositions for EMI electromagnetic interference shielding.

이 특허를 인용한 특허 (53)

  1. Wessling Bernhard M. (Tremsbuttel DEX), Antistatic or electrically semiconducting thermoplastic polymer blends, method of making same and their use.
  2. Eun, Younghyo; Kim, Dukman, Chip package and manufacturing method thereof.
  3. Ko, Dongkyun; Lee, Jung; An, Jaesun, Chip package and manufacturing method thereof.
  4. Ko, Dongkyun; Lee, Jung; An, Jaesun, Chip package and manufacturing method thereof.
  5. Liao, Kuo-Hsien, Chip package and manufacturing method thereof.
  6. Sullivan F. R. (Cleveland Heights OH) Aleska David M. (Parma OH), Coating for EMI shielding.
  7. Sullivan F. Ryan (Cleveland Heights OH) Aleksa David M. (Parma OH), Coating for EMI shielding.
  8. Sullivan F. Ryan (Cleveland Heights OH), Coating for EMI shielding and method for making.
  9. Sullivan F. Ryan (Cleveland Heights OH), Coating of EMI shielding and method therefor.
  10. Hofmann, Achim; Yung, Paul C., Composite polymeric articles formed from extruded sheets containing a liquid crystal polymer.
  11. Chiu, Chi Tsung; Ou, Ying-Te, EMI-shielded semiconductor devices and methods of making.
  12. Memmer, Timothy L., Electrically conductive polymeric mixture, method of molding conductive articles using same, and electrically conductive articles formed therefrom.
  13. Memmer,Timothy L., Electrically conductive polymeric mixture, method of molding conductive articles using same, and electrically conductive articles formed therefrom.
  14. Hijikata Kenji (Mishima JPX) Kanoe Toshio (Fuji JPX), Electrically conductive resin composition.
  15. Ashcraft H. Carl ; May Walter B. ; Dowell Douglas R., Electromagnetic attenuating laminate and method for its formation.
  16. Bryant, Richard; Fixter, Greg PW; Hussain, Shahid; Vaughan, Adrian ST, Electromagnetic field absorbing composition.
  17. Kim, Sang Wan; Lee, Young Sil, Electromagnetic wave shielding thermoplastic resin composition and plastic article including the same.
  18. Nomura Isao (Hiratsuka JPX) Narita Kenichi (Hiratsuka JPX), Electromagnetic wave-shielding thermoplastic resin composition.
  19. Lee, Chun-Che; Su, Yuan-Chang; Lee, Ming Chiang; Huang, Shih-Fu, Embedded component device and manufacturing methods thereof.
  20. Orlowski Thomas E. (Fairport NY) Swift Joseph A. (Ontario NY) Wallace Stanley J. (Victor NY) Peck Wilbur M. (Rochester NY) Courtney John E. (Macedon NY) Rollins David E. (Lyons NY), Fibrillated pultruded electronic component.
  21. Williamson Cecil M. (Carrollton TX), Floatless gauge with resistive/conductive polymer.
  22. Ross ; Jr. Herbert G. ; Taylor Carl A. ; Williamson Cecil M., Linear positioning indicator.
  23. Ross ; Jr. Herbert G. ; Taylor Carl A. ; Williamson Cecil M., Linear positioning indicator.
  24. Aisenbrey,Thomas, Low cost electrical motor components manufactured from conductive loaded resin-based materials.
  25. Aisenbrey,Thomas, Low cost food processing belts and other conveyances manufactured from conductive loaded resin-based materials.
  26. Stanley Podlaseck ; Gene P. Shumaker ; Paul D. Rimer ; Roger A. Purcell, Method of dispersing fibers in electromagnetic-attenuating coating materials.
  27. Aisenbrey, Thomas, Method to form vehicle component devices from conductive loaded resin-based materials.
  28. Cheng, Hung-Hsiang; Lin, Tzu-Chih; Hung, Chang-Ying; Wu, Chih-Wei, Semiconductor device having shielded conductive vias.
  29. Yang, Jun Young; Joo, You Ock; Jung, Dong Pil, Semiconductor device package and manufacturing method.
  30. Yang, Jun Young; Joo, You Ock; Jung, You Pil, Semiconductor device package and manufacturing method.
  31. Yang, Jun Young; Joo, You Ock; Jung, Dong Pil, Semiconductor device package and manufacturing method thereof.
  32. Liao, Kuo-Hsien; Chan, Chi-Hong; Chen, Jian-Cheng; Ueng, Chian-Her; Sun, Yu-Hsiang, Semiconductor device packages having electromagnetic interference shielding and related methods.
  33. An, JaeSeon; Lee, Jeong; Cha, SangJin; Youn, SungHo, Semiconductor device packages with electromagnetic interference shielding.
  34. Chiu, Chi-Tsung; Hung, Chih-Pin; Huang, Jui-Cheng, Semiconductor device packages with electromagnetic interference shielding.
  35. Chiu, Chi-Tsung; Hung, Chih-Pin; Huang, Jui-Cheng, Semiconductor device packages with electromagnetic interference shielding.
  36. Hsu, Chain-Hau, Semiconductor device packages with electromagnetic interference shielding.
  37. Kim, Seokbong; Yun, Yeonsun; Lee, Yuyong, Semiconductor device packages with electromagnetic interference shielding.
  38. Lee, Yuyong; Kim, Seokbong, Semiconductor device packages with electromagnetic interference shielding.
  39. Liao, Kuo-Hsien; Chen, Jian-Cheng; Fan, Chen-Chuan; Chiu, Chi-Tsung; Hung, Chih-Pin, Semiconductor device packages with electromagnetic interference shielding.
  40. Liao, Kuo-Hsien; Chiu, Chi-Tsung; Hung, Chih-Pin, Semiconductor device packages with electromagnetic interference shielding.
  41. Liao, Kuo-Hsien; Chiu, Chi-Tsung; Hung, Chih-Pin, Semiconductor device packages with electromagnetic interference shielding.
  42. Yen, Han-Chee; Chen, Shih-Yuan; Lai, Chien-Pai; Cheng, Ming-Hsien, Semiconductor package having a waveguide antenna and manufacturing method thereof.
  43. Lin, I-Chia; Jou, Sheng-Jian; Yen, Han-Chee, Semiconductor package having an antenna and manufacturing method thereof.
  44. Liao, Kuo-Hsien; Chan, Chi-Hong; Fuyu, Shih, Semiconductor package integrated with conformal shield and antenna.
  45. Yen, Han-Chee; Chung, Chi-Sheng; Liao, Kuo-Hsien; Yeh, Yung-I, Semiconductor package integrated with conformal shield and antenna.
  46. Yang, Jun-Young; Lim, Sung-Mook, Semiconductor package with grounding and shielding layers.
  47. Su, Yuan-Chang; Huang, Shih-Fu; Chen, Chia-Cheng; Chen, Tzu-Hui; Chen, Kuang-Hsiung; Hsieh, Pao-Ming; Lee, Ming Chiang; Appelt, Bernd Karl, Semiconductor package with single sided substrate design and manufacturing methods thereof.
  48. Su, Yuan-Chang; Huang, Shih-Fu; Chen, Chia-Cheng; Chen, Tzu-Hui; Chen, Kuang-Hsiung; Hsieh, Pao-Ming; Lee, Ming Chiang; Appelt, Bernd Karl, Semiconductor package with single sided substrate design and manufacturing methods thereof.
  49. Tsai, Fu-Yung, Semiconductor packages with heat dissipation structures and related methods.
  50. Lin, I-Chia; Tseng, Yu-Chou; Yang, Jin-Feng; Chung, Chi-Sheng; Liao, Kuo-Hsien, Semiconductor packages with thermal dissipation structures and EMI shielding.
  51. Chen, Chia-Ching; Ding, Yi-Chuan, Stackable semiconductor package and manufacturing method thereof.
  52. Hadfield, John Anthony; McGown, Alan Thomson; Mayalarp, Stephen Patrick; Land, Edward John; Hamblett, Ian; Gaukroger, Keira; Lawrence, Nicholas James; Hepworth, Lucy Annette; Butler, John, Substituted stilbenes and their reactions.
  53. Chiu, Chi-Tsung; Liao, Kuo-Hsien; Yih, Wei-Chi; Chen, Yu-Chi; Fan, Chen-Chuan, Wafer-level semiconductor device packages with electromagnetic interference shielding.
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