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Silicon-infiltrated, reaction-bonded silicon carbide molded bodies for application in machine building are produced by means of a siliconizing apparatus, comprising a graphite plate coated with boron nitride, a porous silicon carbide plate coated with a layer of boron nitride, silicon carbide and ca

Silicon-infiltrated, reaction-bonded silicon carbide molded bodies for application in machine building are produced by means of a siliconizing apparatus, comprising a graphite plate coated with boron nitride, a porous silicon carbide plate coated with a layer of boron nitride, silicon carbide and carbon and a layer of lumpy metallic silicon inserted between the two plates. Furthermore, following the heating and solidification of the liquid silicon, wherein due to the increase in volume of the silicon, beads of silicon appear at the surface of the molded body, these may be easily removed when the infiltrated silicon carbide molded bodies are cooled in a nitrogen atmosphere.

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A process for the siliconizing of porous molded silicon carbide bodies, comprising the steps of: (a) placing a molded silicon carbide body which contains elemental carbon onto an apparatus comprising a base plate comprising a graphite plate coated with boron nitride and a support plate, comprising a

A process for the siliconizing of porous molded silicon carbide bodies, comprising the steps of: (a) placing a molded silicon carbide body which contains elemental carbon onto an apparatus comprising a base plate comprising a graphite plate coated with boron nitride and a support plate, comprising a porous plate comprising silicon carbide which is infiltrated with silicon, and a coating which comprises a mixture of boron nitride, silicon carbide and carbon, and a layer comprising silicon therebetween; (b) heating the molded silicon carbide body and support and base plates under vacuum to a temperature higher than the melting point of elemental silicon, for a holding time of from about 0.5 to 6 hours, thereby infiltrating the silicon carbide molded body with silicon; and (c) thereafter cooling the molded body in a nitrogen atmosphere under a pressure of from about 0.05 to 1 bar.