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Method of providing an adherent metal coating on an epoxy surface 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/38
  • H05K-003/24
  • H05K-003/06
  • C25D-005/56
출원번호 US-0543702 (1983-10-20)
발명자 / 주소
  • Shanefield Daniel J. (Princeton Township
  • Mercer County NJ) Verdi Fred W. (Lawrence Township
  • Mercer County NJ)
출원인 / 주소
  • AT&T Technologies, Inc. (Berkeley Heights NJ 02)
인용정보 피인용 횟수 : 30  인용 특허 : 19

초록 ▼

A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface follo

대표청구항 ▼

A method of metallizing an article having a surface comprising a rubber-modified epoxy resin or an epoxy resin having a high degree of unsaturation excluding aromatic unsaturation comprises the steps of: (a) sputter etching the substrate so as to remove at least 50A. from the surface of the substrat

이 특허에 인용된 특허 (19)

  1. Yamaoka Sigenori (Yokohama JPX) Kusuhara Akinobu (Yokohama JPX) Endo Toshinaga (Yokohama JPX), Flexible printed circuit base board and method for producing the same.
    상세보기
  2. Williams ; Jr. ; Robert F. ; Lu ; Chen-i, Laminates useful as packaging materials and container having alkaline fluid means.
    상세보기
  3. Little Michael J. (Tarzana CA) Garvin Hugh L. (Malibu CA) Lee Yat-Shir (Costa Mesa CA), Means and method for inducing uniform parallel alignment of liquid crystal material in a liquid crystal cell.
    상세보기
  4. Wechsung ; Reiner ; Kirschner ; Jurgen, Method and apparatus for controlling the removal, by means of ion etching, of a thin layer from a substrate.
    상세보기
  5. Sato Junichi (Yokohama JPX), Method for making a raw board for use in printed circuits.
    상세보기
  6. Longshore Randolph E. (Alexandria VA), Method for producing a scabrous photosensitive surface.
    상세보기
  7. Saxena Arjun N. (Palo Alto CA) Hart Courtney (San Jose CA), Method of fabricating metal-semiconductor interfaces.
    상세보기
  8. Lombardo ; Michael S. ; Jacovich ; Elaine F. ; D'Ottavio ; Eugene D. ; Grunwald ; John J., Method of making metal-plastic laminates.
    상세보기
  9. Dodd Thomas C. (Millstone Township ; Somerset County NJ) Emerson John A. (Alexandria Township ; Hunterdon County NJ), Method of selectively depositing a metal on a surface by means of sputtering.
    상세보기
  10. Carlson ; Carl S. ; Kinsella ; Lawrence M. ; Pixley ; Daniel L., Method of thermally dimensionally stabilizing a printed circuit board.
    상세보기
  11. Del Monte ; Louis A., Microcircuit device metallization.
    상세보기
  12. Dugan William P. (Pomona CA) Muhr John A. (Claremont CA), One hundred percent pattern plating of plated through-hole circuit boards.
    상세보기
  13. Frank ; Robert I. ; Salzer ; Thomas E., Platinum film resistor device.
    상세보기
  14. Kobayashi ; Hidehiko ; Arakawa ; Tatsumi ; Shiga ; Tetsuo ; Ohmura ; Kao ru ; Ito ; Sakae, Printed circuit board made by dispersion imaging.
    상세보기
  15. Franz Arnold (Troisdorf-Spich DT) Huthwelker Dirk (Troisdorf-Oberlar DT) Jacob Lothar (Eckhausen DT), Printed circuits with arc-retardance.
    상세보기
  16. Bangs Leigh B. (Midland MI) Tuttle Carole K. (Midland MI) Evani Syamalarao (Midland MI), Process of metal plating on plastics.
    상세보기
  17. Grunwald ; John J. ; D'Ottavio ; Eugene D. ; Rhodenizer ; Harold L. ; L ombardo ; Michael S., Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits.
    상세보기
  18. Oshima Renzo (Hachioji JPX) Kyojima Yoshiyuki (Kawasaki JPX) Fujii Takara (Yokohama JPX) Kato Shoji (Yokohama JPX), Production of laminate for receiving chemical plating.
    상세보기
  19. Chapin John S. (Boulder CO), Sputtering process and apparatus.
    상세보기

이 특허를 인용한 특허 (30)

  1. Toy Hilton T. ; Edwards David L. ; Shih Da-Yuan ; Giri Ajay P., Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same.
    상세보기
  2. Bindra Perminder S. (Johnson City NY) Canaperi Donald F. (Bridgewater CT) David Allan P. (Binghamton NY) Light David N. (Friendsville PA), Conditioning a dielectric substrate for plating thereon.
    상세보기
  3. Wen Been Li TW; Kun Ming Yang TW, Conductive polymer device and method of manufacturing same.
    상세보기
  4. Sheek,James G.; Grembowicz,Jarek; Song,Inho; O'Brien,Timothy J., Corrosion and abrasion resistant decorative coating.
    상세보기
  5. Lawrence P. Donovan, III ; Roger J. Timmer, Decorative chrome electroplate on plastics.
    상세보기
  6. O'Brien Timothy J. ; Song Inho ; Trautman Brenda L. ; Bubar Brian S. ; May Darrell K. ; Preston Joseph E. ; Sheek James G. ; Wilder Jeffrey D., Decorative corrosion and abrasion resistant coating.
    상세보기
  7. Xing Guoqiang ; Cerny Glenn A. ; Visokay Mark R., Etchstop for integrated circuits.
    상세보기
  8. Swisher Richard L., Metal-film laminate resistant to delamination.
    상세보기
  9. Kastner, Friedrich; Bergsmann, Martin; Hillburger, Johann; Einsiedler, Ronald; Treutlein, Roland, Metallized film, method for the production thereof, and use thereof.
    상세보기
  10. Kastner,Friedrich; Bergsmann,Martin; Hillburger,Johann; Einsiedler,Ronald; Treutlein,Roland, Metallized film, method for the production thereof, and use thereof.
    상세보기
  11. Burnell Ann Marie ; Lubera John F. ; Oliver Terrence P., Method for improving the adhesion of metal films to polyphenylene ether resins.
    상세보기
  12. Jones Carol R. (Binghamton NY) Susko Robin A. (Owego NY), Method for laminating organic materials via surface modification.
    상세보기
  13. Clarke Thomas C. (Morgan Hill CA) Kovac Caroline A. (Ridgefield CT) Jung Dae Y. (Endwell NY) Park Jae M. (Mahopac NY) Thomas Richard R. (Fishkill NY), Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless met.
    상세보기
  14. Suhr Harald (Tbingen DEX) Haag Christa (Ofterdingen DEX), Method of producing very adhesive metallic structures on fluorine polymers and thermoplastic synthetic materials.
    상세보기
  15. Hilton T. Toy ; David L. Edwards ; Da-Yuan Shih ; Ajay P. Giri, Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly.
    상세보기
  16. Hou, Liping Daniel; Lian, Chuanxin, Methods for fabricating a metal structure for a semiconductor device.
    상세보기
  17. Koyanagi, Tatsunori, Multi-layer double-sided wiring board and method of fabricating the same.
    상세보기
  18. Courduvelis, Constantine I., Platable dielectric materials for microvia technology.
    상세보기
  19. Wolf Gerhard D. (Dormagen DEX) Sirinyan Kirkor (Bergisch-Gladbach DEX) von Gizycki Ulrich (Leverkusen DEX) Merten Rudolf (Leverkusen DEX) Langer Friedrich (Bergisch-Gladbach DEX), Process for producing electrical conductor boards.
    상세보기
  20. Egitto Frank D. (Binghamton NY) Emmi Francis (Binghamton NY) Mlynko Walter E. (Vestal NY) Susko Robin A. (Owego NY), Process for removing contaminant.
    상세보기
  21. Ahnert, Axel; Grandy, Elmar, Process for the production of a circuit portion on a substrate.
    상세보기
  22. Amelio William J. (Austin TX) Markovich Voya (Endwell NY) McCarthy William J. (Binghamton NY) Moring Allen F. (Endicott NY) Moschak Peter A. (Chenango Forks NY) Strope Douglas H. (Apalachin NY), Process for treating reinforced polymer composite.
    상세보기
  23. Lin Charles W. C. ; German Randy L., Selective patterning of metallization on a dielectric substrate.
    상세보기
  24. Henry, Haldane S.; Hong, Eunki; Whitman, Charles S., Semiconductor device with reduced leakage current and method for making the same.
    상세보기
  25. Jones Carol R. (Binghamton NY) Susko Robin A. (Owego NY), Surface modification of organic materials to improve adhesion.
    상세보기
  26. Ahn, Kie Y.; Forbes, Leonard, System-on-a-chip with multi-layered metallized through-hole interconnection.
    상세보기
  27. Ahn,Kie Y.; Forbes,Leonard, System-on-a-chip with multi-layered metallized through-hole interconnection.
    상세보기
  28. Ahn,Kie Y.; Forbes,Leonard, System-on-a-chip with multi-layered metallized through-hole interconnection.
    상세보기
  29. Wang Lixiao ; Hastings Roger ; Buscemi Paul ; Tay Sew-Wah, Temporary stent and method of use.
    상세보기
  30. Anschel Morris (Wappingers Falls NY) Ormond Douglas W. (Wappingers Falls NY) Hayunga Carl P. (Poughkeepsie NY), Thin film metallization process for improved metal to substrate adhesion.
    상세보기

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