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Apparatus for conveying a semiconductor wafer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/306
  • B44C-001/22
  • C03C-015/00
  • C03C-025/06
출원번호 US-0581856 (1984-02-21)
발명자 / 주소
  • Richards Edmond A. (Marlton NJ)
출원인 / 주소
  • Plasma-Therm, Inc. (Kresson NJ 02)
인용정보 피인용 횟수 : 66  인용 특허 : 10

초록

A transfer apparatus for conveying a semiconductor wafer between a first location and a second location comprises transfer arm means including first and second elongated arm members each having first and second ends. The first end of the first arm member is pivotally supported at a point generally m

대표청구항

A transfer apparatus for conveying a semiconductor wafer between a first location at a first pressure and a second location at a second pressure without substantially affecting the pressure at either location comprising: a substantially airtight transfer chamber disposed between the first and second

이 특허에 인용된 특허 (10)

  1. Faretra Ronald A. (Melrose MA), Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface.
  2. Hijikata Isamu (Tokyo JPX) Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of semiconductor wafers by plasma reaction.
  3. Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of wafer materials by plasma reaction.
  4. Yamamoto ; Shinichi ; Sumitomo ; Yasusuke ; Horiike ; Yasuhiro ; Shibag aki ; Masahiro, Etching apparatus using a plasma.
  5. Yamamoto Shinichi (Yokohama JPX) Sumitomo Yasusuke (Yokohama JPX) Horiike Yasuhiro (Tokyo JPX) Shibagaki Masahiro (Hiratsuka JPX), Etching apparatus using a plasma.
  6. Kohman Wayne E. (Wilton CT) Maleri Joseph E. (Bridgeport CT), Load-lock vacuum chamber.
  7. Hassan Javathu K. (Hopewell Junction NY) Mack Alfred (Poughkeepsie NY) Wojtaszek Michael R. (Poughkeepsie NY), Method and apparatus for handling workpieces.
  8. Takahashi Nobuyuki (Fuchu JPX), Processing apparatus comprising a cassette member temporarily swingable to vertically hold a plurality of substrates.
  9. Zajac John (San Jose CA), Wafer support system.
  10. Koch George R. (Los Altos CA) Petersen ; III Carl T. (Fremont CA), Workpiece transfer mechanism.

이 특허를 인용한 특허 (66)

  1. Braginsky Sidney (Dix Hills NY), Apparatus for inspecting wafers.
  2. Mears Eric L. (Rockport MA) Hertel Richard J. (Boxford MA) Brick Robert V. (Gloucester MA) Holt ; Jr. Carl J. (Newburyport MA), Apparatus for retaining wafers.
  3. Mears Eric L. (Rockport MA) Hertel Richard J. (Bradford MA) Brick Robert V. (Gloucester MA), Apparatus for retaining wafers.
  4. Lee Jong-Hyun,KRX ; Yoo Hyung-Joun,KRX ; Choi Boo-Yeon,KRX ; Jang Won-Ick,KRX ; Jang Ki-Ho,KRX, Apparatus for transferring a wafer.
  5. Kasai Kazumi (Atsugi JPX) Itoh Hiromi (Kawasaki JPX) Tanaka Hitoshi (Sagamihara JPX) Oh-hori Tatsuya (Sagamihara JPX) Komeno Junji (Fujisawa JPX), Apparatus of metal organic chemical vapor deposition for growing epitaxial layer of compound semiconductor.
  6. Zejda Jaroslav (Rodenbach DEX) Schuhmacher Manfred (Alzenau-Michelbach DEX), Cathode sputtering system.
  7. Crabb Richard (Mesa AZ) Robinson McDonald (Paradise Valley AZ) Hawkins Mark R. (Mesa AZ) Goodwin Dennis L. (Tempe AZ) Ferro Armand P. (Scottsdale AZ) Ozias Albert E. (Aumsville OR) deBoer Wiebe B. (E, Chemical vapor deposition system.
  8. Hutchinson Martin A. (Santa Clara CA), Gate valve for wafer processing system.
  9. Rigali, Louis A.; Hoffman, David E.; Wang, Keda; Smith, III, William F., High throughput plasma treatment system.
  10. Rigali,Louis A.; Hoffman,David E.; Wang,Keda; Smith, III,William F., High throughput plasma treatment system.
  11. Tyler, James Scott, High-speed symmetrical plasma treatment system.
  12. Helms Dirk (Ahrensburg DEX), Inserting device for vacuum apparatus.
  13. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Bowling Robert A. (Garland TX), Integrated circuit processing system.
  14. Meulen, Peter van der, Linear semiconductor processing facilities.
  15. van der Meulen, Peter, Linear semiconductor processing facilities.
  16. Drage David J. (Sebastopol CA) Lachenbruch Roger B. (Sausalito CA) Drake ; Jr. Herbert G. (San Rafael CA) Peavey Jerris H. (Novato CA), Magnetically coupled wafer lift pins.
  17. Condrashoff, Robert S.; Fazio, James P.; Hoffman, David E.; Tyler, James S., Material handling system and method for a multi-workpiece plasma treatment system.
  18. Condrashoff, Robert Sergel; Fazio, James Patrick; Hoffman, David Eugene; Tyler, James Scott, Material handling system and methods for a multichamber plasma treatment system.
  19. Eror Miroslav (Old Tappan NJ) Biehl Richard E. (Pearl River NY), Method and apparatus for handling and processing wafer-like materials.
  20. Fukuda Shozo,JPX ; Morimoto Masamichi,JPX ; Tanabe Atsushi,JPX ; Yokota Shuichi,JPX, Method and apparatus for visual recognition of a component supplied to an industrial automated system.
  21. van der Meulen, Peter, Mid-entry load lock for semiconductor handling system.
  22. van der Meulen,Peter, Mid-entry load lock for semiconductor handling system.
  23. Swain Eugene A. (Webster NY), Modular apparatus for cleaning, coating and curing photoreceptors in a dual planetary array.
  24. Stark Lawrence R. (San Jose CA) Turner Frederick (Sunnyvale CA), Modular wafer transport and processing system.
  25. Maydan Dan ; Somekh Sasson ; Wang David Nin-Kou ; Cheng David ; Toshima Masato ; Harari Isaac ; Hoppe Peter D., Multiple chamber integrated process system.
  26. Rice, Michael R.; Elliott, Martin R.; Lowrance, Robert B.; Hudgens, Jeffrey C.; Englhardt, Eric A., Overhead transfer flange and support for suspending a substrate carrier.
  27. Rice, Michael R.; Elliott, Martin R.; Lowrance, Robert B.; Hudgens, Jeffrey C.; Englhardt, Eric A., Overhead transfer flange and support for suspending a substrate carrier.
  28. Bowling Robert A. (Garland TX) Larrabee Graydon B. (Dallas TX) Liu Benjamin Y. H. (North Oaks MN), Particle shield.
  29. Ito Natsuko,JPX ; Uesugi Fumihiko,JPX ; Moriya Tsuyoshi,JPX, Particle-removing apparatus for a semiconductor device manufacturing apparatus and method of removing particles.
  30. Takahashi Kazuo,JPX ; Ban Mikichi,JPX ; Nishimura Matsuomi,JPX, Precision polishing apparatus.
  31. Takahashi Kazuo,JPX ; Ban Mikichi,JPX ; Nishimura Matsuomi,JPX, Precision polishing method using hermetically sealed chambers.
  32. Davis Cecil J. (Greenville TX) Abernathy Joseph V. (Wylie TX) Matthews Robert T. (Plano TX) Hildenbrand Randall C. (Richardson TX) Simpson Bruce (Dallas TX) Bohlman James G. (Forney TX) Loewenstein L, Processing apparatus.
  33. Akimoto Masami,JPX ; Ueda Issei,JPX, Processing system.
  34. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
  35. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
  36. Kent, Richard J., Robotic assembly providing leveling and joint stress reduction.
  37. Tepolt Gary B., Robotic wafer handler.
  38. van der Meulen, Peter, Semiconductor manufacturing systems.
  39. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
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  41. van der Meulen, Peter; Kiley, Christopher C.; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling transport.
  42. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Hildenbrand Randall C. (Richardson TX), Semiconductor wafer transfer method and arm mechanism.
  43. Bhola De ; Mark Spencer Grey, Spatula for separation of thinned wafer from mounting carrier.
  44. Messer Mark G. (Los Gatos CA) Stark Lawrence R. (San Jose CA), Sputter module for modular wafer processing system.
  45. van der Meulen, Peter, Stacked process modules for a semiconductor handling system.
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  47. Watanabe Hayao,JPX, Substrate transfer apparatus.
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  49. Hine Derek ; Hine Roger ; Selvik Eric ; Lorell Kenneth ; Marical Jeffrey, Transport apparatus for semiconductor wafers.
  50. Strasser Gregor (Vaduz LIX) Zhrer Gerald (Weite CHX) Schertler Roman (Wolfurt ATX) Fischer Heinrich (Triesen LIX), Transport system for conveying workpiece between first and second media.
  51. Yasar Tugrul ; Robison Rodney Lee ; Deyo Daniel ; Zielinski Marian, Transport system for wafer processing line.
  52. Tamura Naoyuki (Kudamatsu JPX) Kanai Norio (Kudamatsu JPX), Vacuum apparatus.
  53. Ramsay, Bruce Gordon, Vacuum chamber load lock structure and article transport mechanism.
  54. Ramsay, Bruce Gordon, Vacuum chamber load lock structure and article transport mechanism.
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  56. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Hildenbrand Randall C. (Richardson TX), Vacuum processing system.
  57. Chrisos John M. (Beverly MA) Fowler ; Jr. Bertram F. (Danvers MA) Muka Richard S. (Topsfield MA), Wafer handling apparatus.
  58. Shimane Kazuo (Kawasaki JPX) Iijima Nobuo (Tama JPX) Kawabata Tatsuro (Kawasaki JPX), Wafer positioning apparatus.
  59. Dimock Jack A. (Santa Barbara CA) Woestenburg Dirk P. (Summerland CA), Wafer processing machine with evacuated wafer transporting and storage system.
  60. Nakamura Osamu,JPX ; Ichikawa Shigeru,JPX ; Arai Tsuneharu,JPX, Wafer ring supply and return device.
  61. Hertel Richard J. (Bradford MA) Delforge Adrian C. (Rockport MA) Mears Eric L. (Rockport MA) MacIntosh Edward D. (Gloucester MA) Jennings Robert E. (Nethuen MA) Bhargava Akhil (Reading MA), Wafer transfer system.
  62. Kinnard, David William; Richardson, Daniel, Wafer transport apparatus.
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  65. Crandell Rod, Work piece transfer apparatus.
  66. Hirahara Yorio,JPX ; Maetani Haruo,JPX, Work transport control method.
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