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Apparatus for changing and repairing printed circuit boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B44C-001/22
  • B32B-031/00
  • C23F-001/02
  • B29C-017/08
출원번호 US-0717202 (1985-03-28)
발명자 / 주소
  • McGinty Joseph R. (Healdsburg CA) Donnelly Kevin A. (Huntsville AL)
출원인 / 주소
  • Avco Corporation (Huntsville AL 02)
인용정보 피인용 횟수 : 35  인용 특허 : 8

초록

A printed circuit board modification and repair system is presented which functions under computer control. Modification is accomplished by securing the printed circuit board to an X-Y positioning fixture mounted on a work station table. After indexing to a reference point, the X-Y positioning fixtu

대표청구항

Apparatus for changing and repairing printed circuit boards having a plurality of foil strip conductors etched thereon, the plurality of conductors being conformal coated for protection, each conductor terminating at a pad capable of receiving electronic circuit components, the apparatus comprising:

이 특허에 인용된 특허 (8)

  1. May Gordon M. (Cedar Springs MI), Circuit board assembly.
  2. McKenzie ; Jr. Joseph A. (6330 Laura La. Pleasanton CA 94566), Component mask for printed circuit boards and method of use thereof.
  3. Pierson Mark V. (28 Ogden St. Binghamton NY 13901), Longitudinally fed component insertion apparatus.
  4. Janisiewicz Stanley (Endwell NY) Holmes Robert H. (Binghamton NY), Multi-module dip transfer and insertion machine.
  5. Kowalski ; John Lawrence ; Michaels ; Mark Joseph ; Schieve ; Edmund H arold, Placement machine.
  6. Holt Richard C. (Fairhaven MA), Process for interconnecting components on a PCB.
  7. von Roesgen Charles A. (Westfield NJ), Quick-connect interconnection system.
  8. Whitehead Robert E. (Irving TX), System for manufacturing, changing, repairing, and testing printed circuit boards.

이 특허를 인용한 특허 (35)

  1. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY) Welles ; II Kenneth B. (Schenectady NY), Adaptive lithography system to provide high density interconnect.
  2. Swiggett Brian E. (Huntington NY) Morino Ronald (Sea Cliff NY) Keogh Raymond J. (Huntington NY) Crowell Jonathan C. (Lakeville MA), Apparatus for making scribed circuit boards and circuit board modifications.
  3. Sin,Tae Myung, Apparatus for replacing defective PCB from PCB panel.
  4. Hertz, Allen David, Apparatus for selectively applying solder mask.
  5. Koene Johan Willem,NLX, Arrangement for the manufacture of multilayers.
  6. Noy, Amir; Davara, Gilad, Automatic repair of electric circuits.
  7. Ono, Harry, Automatic soldering machine.
  8. Zhang, Shao-bo; Chen, Sung-lin; Wu, Xiao-lin, Automatic soldering machine.
  9. Gall, Michael R., Detachable magnetic ground strap assembly.
  10. Choi,Bong Kyu; Choi,Chun Ho, Device for coupling PCB sheet.
  11. Choi,Bong Kyu; Choi,Chun Ho, Device for coupling PCB sheet.
  12. Choi,Bong Kyu; Choi,Chun Ho, Device for coupling PCB sheet.
  13. Choi,Bong Kyu; Choi,Chun Ho, Device for coupling PCB sheet having position deciding jig part.
  14. Shimizu Yasuhiko (Yokohama JPX), Die bonding method.
  15. Reed Ronald G. (Colorado Springs CO), Forming plated through holes in a printed circuit board by using a computer controlled plotter.
  16. Eichelberger Charles W. (Schenectady NY) Welles ; II Kenneth B. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY), Integrated circuit packaging configuration for rapid customized design and unique test capability.
  17. Hokanson John M. (Hutchinson MN) Bentz Kenneth S. (Hutchinson MN) Field Terrence G. (Hutchinson MN) Ziegler David A. (Darwin MN), Laser soldering apparatus and method.
  18. Chou,Stephen Y., Lithographic apparatus for molding ultrafine features.
  19. Matsushita, Kotaro, Method and apparatus for laser soldering.
  20. Seshan, Ramanathan, Method and apparatus for programming a paste dispensing machine.
  21. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY) Welles ; II Kenneth B. (Schenectady NY), Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer.
  22. Choi, Bong Kyu; Choi, Chun Ho, Method for coupling PCB sheet.
  23. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY) Welles ; II Kenneth B. (Schenectady NY), Method for packaging integrated circuit chips employing a polymer film overlay layer.
  24. Sin, Tae Myung, Method for replacing defective PCB from PCB panel.
  25. Morino Ronald (Sea Cliff NY) Swiggett Brian E. (Huntington NY) Keogh Raymond J. (Huntington NY) Crowell Jonathan C. (Lakeville MA), Method for scribing conductors via laser.
  26. Hertz, Allen D., Method for selectively applying solder mask.
  27. Gofuku Eishi (Amagasaki JPX) Takasago Hayato (Amagasaki JPX), Method for separating bonded substrates, in particular disassembling a liquid crystal display device.
  28. Chou, Stephen Y.; Yu, Zhaoning; Wu, Wei, Method of making an article comprising nanoscale patterns with reduced edge roughness.
  29. Currie, Thomas P., Method of reworking a multilayer printed circuit board assembly.
  30. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY), Multichip integrated circuit packaging configuration and method.
  31. Klein Dean A., Printed circuit board assembly and method for making a printed circuit board assembly.
  32. Reed Ronald G. (Colorado Springs CO) Rasper John T. (Colorado Springs CO), Process for use in rapidly producing printed circuit boards using a computer controlled plotter.
  33. Westervelt Richard A. (Winsted CT), Radiation supply and adhesive dispensing system.
  34. Matsushita Hideharu,JPX, Restructure support device and method for printed-wiring board.
  35. Swiggett Brian E. (Huntington NY) Morino Ronald (Sea Cliff NY) Keogh Raymond J. (Huntington NY) Crowell Jonathan C. (Lakeville MA) Szenczy George (Northport NY) Schoenberg Andrew J. (Huntington NY) F, Wire scribed circuit boards and method of manufacture.
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