초록 ▼

An immersion cooling system for high density electronic assemblies such as computers includes a container holding an inert cooling liquid, and stacks of circuit modules arranged in a generally radial pattern within the container. Coolant supply columns and coolant removal columns alternate between a

An immersion cooling system for high density electronic assemblies such as computers includes a container holding an inert cooling liquid, and stacks of circuit modules arranged in a generally radial pattern within the container. Coolant supply columns and coolant removal columns alternate between adjacent stacks around the pattern. The coolant supply columns include distribution manifolds which distribute incoming coolant at all levels to provide a flow of coolant to all circuit modules. The flow passes between adjacent boards of the modules and preferably along flow channels formed by the circuit chips aligned in rows. After passing across the circuit modules the heated coolant rises in coolant removal columns and flows over standpipes for removal from the container, and a pump and heat exchanger recools and recirculates the coolant. Pump up and pump down systems are also provided for withdrawing the coolant to a reservoir for servicing the circuitry.

대표청구항 ▼

A liquid immersion cooled electronic assembly, comprising: a liquid coolant container; a plurality of stacks of spaced circuit boards; means positioning said stacks within said liquid coolant container adjacent one another and spaced apart, the spaces between said stacks forming coolant columns; and

A liquid immersion cooled electronic assembly, comprising: a liquid coolant container; a plurality of stacks of spaced circuit boards; means positioning said stacks within said liquid coolant container adjacent one another and spaced apart, the spaces between said stacks forming coolant columns; and means for supplying a flow of coolant to some of said columns adjacent said stacks and means for removing coolant from others of said columns, said means for supplying coolant and said means for removing coolant connected respectively to alternate columns, said columns to which coolant is supplied and columns from which coolant is removed being on opposite sides of stacks so that coolant supplied on one side of a stack flows between said spaced circuit boards therein to the other side thereof where it is removed to thereby establish coolant circulation across said circuit boards to cool circuit components thereon.