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Composition useful for stripping photoresist polymers and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-007/00
  • C09D-009/04
출원번호 US-0668546 (1984-11-05)
발명자 / 주소
  • Johnson M. Anthony (Baton Rouge LA)
출원인 / 주소
  • The Dow Chemical Company (Midland MI 02)
인용정보 피인용 횟수 : 36  인용 특허 : 1

초록

This invention is a composition suitable for stripping cross-linked photoresist polymer which comprises (a) a lower alkyl monoether of a propylene glycol, or a mixture of lower alkyl monoethers of propylene glycol; (b) a C2-6 alkanol; (c) an alkanolamine; and (d) a base.

대표청구항

A composiion suitable for stripping cross-linked photoresist polymer which comprises (a) between about 40 and 75 percent by weight of a lower alkyl monoether of a propylene glycol, or a mixture of lower alkyl monethers of propylene glycol; (b) between about 10 and 30 percent by weight of a C2-6 alka

이 특허에 인용된 특허 (1)

  1. Zuber John R. (Piscataway NJ) Foxman Herbert (Raritan NJ), Method of stripping photoresist.

이 특허를 인용한 특허 (36)

  1. Spratling, Michael, Adhesive removal compositions and methods of using same.
  2. Neisius Karl H. (Darmstadt DEX) Litters Alois (Lampertheim Hofheim DEX), Agent and method for the removal of photoresist and stripper residues from semiconductor substrates.
  3. Hei, Robert D. P.; Wei, Guang-jong J.; Halsrud, David A.; Smith, Kim R.; Podtburg, Teresa C., Antimicrobial composition.
  4. Hei, Robert D. P.; Wei, Guang-jong J.; Halsrud, David A.; Smith, Kim R.; Podtburg, Teresa C., Antimicrobial composition.
  5. Hei,Robert D. P.; Wei,Guang jong J.; Halsrud,David A.; Smith,Kim R.; Podtburg,Teresa C., Antimicrobial composition.
  6. Wiseth, Wendy M.; Smith, Kim R.; Man, Victor F.; De Fields, Scott I.; Rabon, Reid; Levitt, Mark D., Aqueous organic dispersions suitable for removing organic films and soils.
  7. Momoda Kayo (Tsukuba JPX) Baba Syuji (Tokuyama JPX), Cleaning agent for removing fats and oils from metal surfaces.
  8. Dingess John A. ; Osmanski Frank A., Cleaning compositions and methods.
  9. Durham Dana (Bloomsbury NJ), Composition containing a mixture of hexa-alkyl disilazane and propylene glycol alkyl ether and/or propylene glycol alkyl.
  10. Lee, Wai Mun, Compositions and processes for photoresist stripping and residue removal in wafer level packaging.
  11. Lee, Wai Mun, Compositions and processes for photoresist stripping and residue removal in wafer level packaging.
  12. Ngo David D. ; Swamy Som S., Environmentally friendly removal of photoresists used in wet etchable polyimide processes.
  13. McKay, Jennifer; Cox, Charles K.; Wilson, Neil R., Flushing solutions for coatings removal.
  14. Keith E. Olson ; Bryan M. Anderson ; Kim R. Smith, Method for removing an ultraviolet light cured floor finish, removable ultraviolet light curable floor finish and strippable finished floor.
  15. Olson, Keith E.; Anderson, Bryan M.; Smith, Kim R., Method for removing an ultraviolet light cured floor finish, removable ultraviolet light curable floor finish and strippable finished floor.
  16. Griese,Gregory G.; Levitt,Mark D.; Leafblad,Brian R.; Li,Minyu; Hei,Robert D. P., Method for stripping floor finishes using composition that thickens upon dilution with water.
  17. Sato Mitsuru,JPX ; Nagatsuka Naomi,JPX ; Nagasawa Koichi,JPX ; Shimai Hutoshi,JPX ; Harada Kouji,JPX, Method for the pre-treatment of a photoresist layer on a substrate surface.
  18. Nagasawa Koichi,JPX ; Kawaguchi Naomi,JPX ; Shimai Futoshi,JPX ; Sato Mitsuru ; Harada Kouji,JPX ; Koshiyama Jun,JPX, Method of removing coating from edge of substrate.
  19. Ciccolo, Paul J.; Amos, Brian D.; McCammon, Stephen, Method of removing negative acting photoresists.
  20. Smith, Kim R.; Levitt, Mark D.; Hei, Robert D. P., Phase-separating solvent composition.
  21. Smith,Kim R.; Levitt,Mark D.; Hei,Robert D. P.; Olson,Keith E.; Anderson,Bryan M., Phase-separating solvent composition.
  22. Durham Dana (Bloomsbury NJ), Photoresist treating composition consisting of a mixture of propylene glycol alkyl ether and propylene glycol alkyl ethe.
  23. Durham Dana (Bloomsbury NJ), Positive photoresist containing a mixture of propylene glycol alkyl ethers and propylene glycol alkyl ether acetate.
  24. Durham Dana (Bloomsbury NJ), Positive photoresist with a solvent mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate.
  25. Johnson Thomas Albert ; Leeaphon Malee, Process for removing insoluable N-vinyl amide polymer from equipment.
  26. Gupta Ashis S. (Marietta GA) Camp Jerald T. (Loganville GA), Process for the extraction of contaminants from plastics.
  27. Durham Dana (Bloomsbury NJ), Process of using photoresist treating composition containing a mixture of a hexa-alkyl disilazane, propylene glycol alky.
  28. Honda Kenji (Barrington RI) Hurditch Rodney (Providence RI), Redox reagent-containing post-etch residue cleaning composition.
  29. Yamamoto Kenji,JPX ; Igawa Akihiko,JPX, Rinsing solution.
  30. Olson, Keith E.; Jackson, Victoria Jeanne, Strippable coating system.
  31. Griese, Gregory G.; Levitt, Mark D.; Leafblad, Brian R.; Li, Minyu; Hei, Robert D. P.; Lange, Steven J.; Shulman, Jan E., Stripping floor finishes using composition that thickens following dilution with water.
  32. Eberhardt Werner (Leichlingen DEX) Ziegler Rudolf (Kuerten DEX), Stripping paste for removing lacquer and paint coatings.
  33. Harumoto, Masahiko; Yamaguchi, Akira; Hisai, Akihiro, Substrate developing method and developing apparatus.
  34. Weiss, William S., Water-based cleaning agent and method for cleaning a spray gun.
  35. Fedrigo,Nadine; Moore,Michael E.; Patzelt,Robert R.; Summerfield,Stephen, Water-based purge composition.
  36. Seijo, Ma. Fatima; Wojtczak, William A.; Bernhard, David; Baum, Thomas H.; Minsek, David, pH buffered compositions useful for cleaning residue from semiconductor substrates.
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