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Photosensitive conductive metal composition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03C-005/44
출원번호 US-0685028 (1984-12-21)
발명자 / 주소
  • Felten John J. (Newark DE)
출원인 / 주소
  • E. I. Du Pont de Nemours and Company (Wilmington DE 02)
인용정보 피인용 횟수 : 20  인용 특허 : 3

초록

A photosensitive conductive metal coating composition which is fireable in a weakly oxidizing atmosphere comprising an admixture of a. Smooth finely divided particles of conductive metal, and b. Finely divided particles of cadmium-containing lead aluminosilicate glass, dispersed in a solution of c.

대표청구항

A photosensitive conductive metal coating composition which is fireable in a weakly oxidizing atmosphere comprising an admixture of: a. Smooth finely divided particles of conductive metal, at least 80% wt. of which (1) have an aspect ratio of no more than 2 and (2) have a particle size of 2-6 mm, an

이 특허에 인용된 특허 (3)

  1. Spickenreuther Dieter (Wettingen CHX), Method for the etching of silicon substrates and substrate for the execution of the method.
  2. Inskip Harold Kirkwood (Newark DE), Photopolymerizable paste composition.
  3. Inskip Harold Kirkwood (Newark DE), Photopolymerizable paste compositions and their use.

이 특허를 인용한 특허 (20)

  1. Kawakita Kouji (Joyo JPX) Nakatani Seiichi (Hirakata JPX) Ogawa Tatsuo (Amagasaki JPX) Suehiro Masatoshi (Kyoto JPX) Iwaisako Kouichi (Uji JPX) Akiyama Hideo (Kyoto JPX), Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste.
  2. Kawakita Kouji,JPX ; Nakatani Seiichi,JPX ; Ogawa Tatsuo,JPX ; Suehiro Masatoshi,JPX ; Iwaisako Kouichi,JPX ; Akiyama Hideo,JPX, Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of ma.
  3. Kawakita Kouji,JPX ; Nakatani Seiichi,JPX ; Ogawa Tatsuo,JPX ; Suehiro Masatoshi,JPX ; Iwaisako Kouichi,JPX ; Akiyama Hideo,JPX, Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of ma.
  4. Katoh Toshihiro,JPX ; Kuriyama Takao,JPX ; Takei Tatsuya,JPX ; Kawai Takashi,JPX ; Murakami Hiroshi,JPX ; Munemoto Eiji,JPX ; Ohta Norio,JPX ; Shimada Koji,JPX, Display substrate, conductor, and insulator.
  5. Hayakawa,Keiichiro, Electrode-forming composition for field emission type of display device, and method using such a composition.
  6. Hayakawa,Keiichiro, Electrode-forming composition for field emission type of display device, and method using such a composition.
  7. Amey, Jr.,Daniel Irwin, Field emitter cathode backplate structures for display panels.
  8. Kodas, Toivo T.; Hampden Smith, Mark J.; Caruso, James; Powell, Quint H.; Ludviksson, Audunn, Glass powders, methods for producing glass powders and devices fabricated from same.
  9. Kodas, Toivo T.; Hampden-Smith, Mark J.; Caruso, James; Powell, Quint H.; Ludviksson, Audunn, Glass powders, methods for producing glass powders and devices fabricated from same.
  10. Kanbara, Hiroyuki; Towata, Shuuichi; Iha, Michiaki, Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste.
  11. Toivo T. Kodas ; Mark J. Hampden-Smith ; James Caruso ; Quint H. Powell ; Audunn Ludviksson, Methods for producing glass powders.
  12. Nebe William J. (Wilmington DE) Osborne James J. (Kennett Square PA), Photosensitive aqueous developable copper conductor composition.
  13. Nebe William J. (Wilmington DE) Osborne James J. (Kennett Square PA), Photosensitive aqueous developable gold conductor composition.
  14. Choi John Haetak ; Drysdale Neville Everton, Photosensitive ceramic compositions containing polycarbonate polymers.
  15. Kubota, Masahiro, Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element.
  16. Kubota, Masahiro, Photosensitive copper paste and method of forming copper pattern using the same.
  17. Katoh Toshihiro,JPX ; Kuriyama Takao,JPX ; Takei Tatsuya,JPX ; Kawai Takashi,JPX ; Murakami Hiroshi,JPX ; Munemoto Eiji,JPX ; Ohta Norio,JPX ; Shimada Koji,JPX, Photosensitive slurry.
  18. Frank St. John, Printed wiring board conductive via hole filler having metal oxide reducing capability.
  19. Draghi Peter J. ; Shurman Brian J. ; Borruso Michael V., Process for precisely closing off cooling holes of an airfoil.
  20. Farr,Isaac; Lambright,Terry M.; Kasperchik,Vladek P; Oriakhi,Christopher; Neel,David A, Solid freeform compositions, methods of application thereof, and systems for use thereof.
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