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Electrolysis cell for a molten electrolyte 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25C-003/04
  • C25C-003/22
출원번호 US-0700293 (1985-02-11)
우선권정보 GB-0022665 (1982-08-06)
발명자 / 주소
  • Sivilotti Olivo G. (Kingston CAX)
출원인 / 주소
  • Alcan International Limited (Montreal CAX 03)
인용정보 피인용 횟수 : 55  인용 특허 : 2

초록

A cell for producing magnesium or other metal by electrolysis of molten chloride or other electrolyte comprises at least one electrode assembly of an anode 24, at least one intermediate bipolar electrode 28, 30, 32, 34 and a cathode 26 defining generally vertical interelectrode spaces between them.

대표청구항

An electrolyte cell for the production of a metal by electrolysis of a molten electrolyte which is more dense than the metal, comprising, an electrolysis chamber 16 including at least one electrode assembly of a anode 24 having a major face and also at least one other face selected from an end face

이 특허에 인용된 특허 (2)

  1. Ishizuka Hiroshi (19-2 ; Ebara 6-chome Shinagawa-Ku ; Tokyo JPX), Apparatus and method for electrolysis of MgCl2.
  2. Ishizuka Hiroshi (19-2 ; Ebara 6-chome Shinagawa-ku ; Tokyo JPX), Apparatus for electrolytic production of magnesium metal from its chloride.

이 특허를 인용한 특허 (55)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
  2. He, Zhian, Anisotropic high resistance ionic current source (AHRICS).
  3. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  4. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
  5. Kagajwala, Burhanuddin; Buckalew, Bryan L.; Chua, Lee Peng; Berke, Aaron; Rash, Robert; Mayer, Steven T., Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity.
  6. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  7. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  8. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  9. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.
  10. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.
  11. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  12. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  13. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  14. He, Zhian; Zhou, Jian; Feng, Jingbin; Reid, Jonathan D.; Ghongadi, Shantinath, Control of electrolyte flow dynamics for uniform electroplating.
  15. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  16. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  17. Mayer, Steven T.; Porter, David W.; Goh, Edwin; Buckalew, Bryan L.; Rash, Robert, Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  18. Mayer, Steven T.; Patton, Evan E.; Jackson, Robert L.; Reid, Jonathan D., Copper electroplating method and apparatus.
  19. Ponnuswamy, Thomas A.; Sukamto, John H.; Reid, Jonathan D.; Mayer, Steven T.; Zhu, Huanfeng, Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers.
  20. Ponnuswamy, Thomas A.; Sukamto, John H.; Reid, Jonathan D.; Mayer, Steven T., Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers.
  21. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.
  22. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.
  23. Graham, Gabriel Hay; Hiester, Jacob Lee; Chua, Lee Peng; Buckalew, Bryan L., Dynamic modulation of cross flow manifold during electroplating.
  24. Graham, Gabriel Hay; Buckalew, Bryan L.; Mayer, Steven T.; Rash, Robert; Fortner, James Isaac; Chua, Lee Peng, Edge flow element for electroplating apparatus.
  25. Sivilotti Olivo G. (Kingston CAX), Electrolytic cell for the production of a metal.
  26. Daniel J. Woodruff ; Kyle M. Hanson, Electroplating apparatus with segmented anode array.
  27. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  28. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  29. Feng, Jingbin; He, Zhian; Rash, Robert; Mayer, Steven T., Electroplating apparatus with vented electrolyte manifold.
  30. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  31. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  32. Mayer, Steven T.; Reid, Jonathan D., High resistance ionic current source.
  33. Waite Peter D.,CAX, Injector for gas treatment of molten metals.
  34. Kim, Doyeon; Ghongadi, Shantinath; Takada, Yuichi; Huang, Ludan; Majid, Tariq, Membrane design for reducing defects in electroplating systems.
  35. Sivilotti Olivo,CAX ITX K7M 1P1, Method and apparatus for electrolysing light metals.
  36. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
  37. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
  38. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
  39. Reid, Jonathan; Buckalew, Bryan; He, Zhian; Park, Seyang; Varadarajan, Seshasayee; Pennington, Bryan; Ponnuswamy, Thomas; Breling, Patrick; Ibarreta, Glenn; Mayer, Steven, Method and apparatus for electroplating.
  40. Reid, Jonathan D.; Zhu, Huanfeng, Method and apparatus for filling interconnect structures.
  41. Reid, Jonathan D.; Zhu, Huanfeng, Method and apparatus for filling interconnect structures.
  42. Mayer, Steven T.; Patton, Evan E.; Blackman, Brian Paul; Reid, Jonathan D.; Ponnuswamy, Thomas Anand; Perry, Harold D., Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources.
  43. Mayer, Steven T.; Reid, Jonathan D., Method of electroplating using a high resistance ionic current source.
  44. Mayer, Steven T; Reid, Jonathan D., Method of electroplating using a high resistance ionic current source.
  45. Sivilotti Olivo Giuseppe,CAX ; Vandermeulen Meine,CAX ; Iseki Junkichi,JPX, Multi-polar cell for the recovery of a metal by electrolysis of a molten electrolyte.
  46. Mayer, Steven T.; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Feng, Jingbin, Plating method and apparatus with multiple internally irrigated chambers.
  47. Mayer, Steven; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Feng, Jingbin, Plating method and apparatus with multiple internally irrigated chambers.
  48. Mayer, Steven T.; Drewery, John S., Rotationally asymmetric variable electrode correction.
  49. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
  50. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  51. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  52. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  53. Reid, Jonathan; Park, Seyang; Varadarajan, Seshasayee; Doubina, Natalia, Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers.
  54. Mayer, Steven T., Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction.
  55. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
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