초록 ▼

A printed wiring board laminate is disclosed that is particularly suitable for use with leadless surface mounted devices such as ceramic chip carries. The laminate combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprise

A printed wiring board laminate is disclosed that is particularly suitable for use with leadless surface mounted devices such as ceramic chip carries. The laminate combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprises a support fabricated from graphite fiber reinforced metal adhesively secured to a printed wiring board fabricated from dielectric (e.g., glass) fiber reinforced resin. The support has an X-Y coefficient of thermal expansion less than about 4 ppm/°C., and the printed wiring board has a coefficient of thermal expansion greater than about 10 ppm/°C. In a second embodiment, the support comprises a core of graphite fiber reinforced metal or resin sandwiched between two metal sheets.

대표청구항 ▼

A printed wiring board laminate adapted for use with a ceramic chip carrier, the printed wiring board laminate comprising: an electrically conductive support comprising a metal matrix reinforced by graphite fiber, the support having a coefficient of thermal expansion parallel to the surface of the l

A printed wiring board laminate adapted for use with a ceramic chip carrier, the printed wiring board laminate comprising: an electrically conductive support comprising a metal matrix reinforced by graphite fiber, the support having a coefficient of thermal expansion parallel to the surface of the laminate of less than about 4 parts per million/°C.; and a printed wiring board comprising dielectric fiber reinforced resin, the printed wiring board being secured to the support by means of an adhesive and having a coefficient of thermal expansion greater than about 10 parts per million/°C.; whereby the apparent coefficient of thermal expansion of the laminate parallel to the surface of the laminate approximates the coefficient of thermal expansion of a ceramic chip carrier, and whereby heat generated by components mounted to the printed wiring board may be conducted away by the support.