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Fixed abrasive polishing media 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-003/00
출원번호 US-0764909 (1985-08-12)
발명자 / 주소
  • Thicke Ricky P. (Stewartville MN) O\Brien Stanley B. (Hayfield MN) Nordyke David M. (Rochester MN) Fox Dennis L. (Rochester MN) Folkert Thomas E. (Hammond MN) Diemer Bruce R. (LeRoy MN)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 32  인용 특허 : 4

초록

An improved method and formulation is shown for preparing polishing media for superfinishing pure metal surfaces. A combination of hydrophobic and hydrophilic silicone surfactants is used to control the porosity and water absorption during use whereby durability is obtained and the catalyst concentr

대표청구항

The method of making a polishing pad for superfinishing metal substrate surfaces comprising fast mixing at a temperature of less than 120 degrees Fahrenheit the following ingredients in parts by weight: approximately 50 parts polyol approximately 100 parts abrasive particles 0.35 to 0.50 parts water

이 특허에 인용된 특허 (4)

  1. Ottman John C. (San Jose CA) Shen John C. S. (Rochester MN), Fixed abrasive polishing method and apparatus.
  2. Hundebol Keld O. (Kanalvej 22 Ansager DKX 6823), Method for producing a grinding- or polishing disc and a machine for this purpose.
  3. Rosenblum Marc (Milltown NJ), Polishing compositions.
  4. Yancey Paul J. (Matthews NC), Precision polishing suspension and method for making same.

이 특허를 인용한 특허 (32)

  1. Nelson Leonard E. (Lake Elmo MN) Van Loc X. (Minneapolis MN), Abrasive composition and articles incorporating same.
  2. Beardsley Kris A. ; Lise Jonathan M. ; Minick Chris A. ; Muir Richard B.,CAX ; Niccum Brent D. ; Sanders ; Jr. Rufus C. ; Sheely Jeffrey D., Abrasive foam article and method of making same.
  3. Moren Louis S. (White Bear Lake MN), Abrasive wheels.
  4. Benesch, Robert; Haouchine, Malik; Jacksier, Tracey, Articles of manufacture containing increased stability low concentration gases and methods of making and using the same.
  5. Benesch, Robert; Haouchine, Malik; Jacksier, Tracey, Articles of manufacture containing increased stability low concentration gases and methods of making and using the same.
  6. Benesch, Robert; Haouchine, Malik; Jacksier, Tracey, Articles of manufacture containing increased stability low concentration gases and methods of making and using the same.
  7. Dornfeld,David; Lee,Sunghoon, CMP pad with designed surface features.
  8. Hata William Y., Catalytic acceleration and electrical bias control of CMP processing.
  9. Obeng,Yaw S.; Thomas,Peter A.; Kelly,Patrick J., Compacted polishing pads for improved chemical mechanical polishing longevity.
  10. Lombardo, Brian, Foam semiconductor polishing belts and pads.
  11. Lombardo, Brian; Otto, Jeffrey P., Froth and method of producing froth.
  12. Jacksier, Tracey; Benesch, Robert, Increased stability low concentration gases, products comprising same, and methods of making same.
  13. Beardsley Kris A. ; Lise Jonathan M. ; Niccum Brent D. ; Sanders ; Jr. Rufus C., Method and apparatus for manufacturing abrasive articles.
  14. Obeng, Yaw S.; Yokley, Edward M., Method of altering and preserving the surface properties of a polishing pad and specific applications therefor.
  15. Obeng, Yaw S.; Yokley, Edward M., Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor.
  16. Sanders ; Jr. Rufus C., Method of making a foraminous abrasive article.
  17. Walter J. Urbanavage ; Heinz F. Reinhardt, Method of polishing using a polishing pad.
  18. Beardsley Kris A. ; Lise Jonathan M. ; Niccum Brent D., Nonwoven abrasive articles.
  19. Obeng, Yaw S.; Yokley, Edward M., Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof.
  20. Obeng, Yaw S.; Yokley, Edward M.; Richardson, Kathleen C., Polishing pad composition and method of use.
  21. Yu Chris Chang, Polishing pad for chemical-mechanical polishing of a semiconductor substrate.
  22. Yu Tat-Kwan (Austin TX) Yu Chris C. (Austin TX), Polishing pad for chemical-mechanical polishing of a semiconductor substrate.
  23. Obeng, Yaw S., Polishing pad resistant to delamination.
  24. Jacksier, Tracey; Benesch, Robert; Haouchine, Malik, Reactive gases with concentrations of increased stability and processes for manufacturing same.
  25. Jacksier, Tracey; Benesch, Robert; Haouchine, Malik, Reactive gases with concentrations of increased stability and processes for manufacturing same.
  26. Jacksier,Tracey; Benesch,Robert; Kuhn,John, Reduced moisture compositions comprising an acid gas and a matrix gas, articles of manufacture comprising said compositions, and processes for manufacturing same.
  27. Jacksier,Tracey; Benesch,Robert; Kuhn,John, Reduced moisture compositions comprising an acid gas and a matrix gas, articles of manufacture comprising said compositions, and processes for manufacturing same.
  28. Jonathan M. Lise ; Chris A. Minick, Resilient abrasive article with hard anti-loading size coating.
  29. Lise Jonathan M. ; Minick Chris A., Resilient abrasive article with hard anti-loading size coating.
  30. Obeng, Yaw S.; Yokley, Edward M., Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor.
  31. Yokley, Edward M.; Obeng, Yaw S., Substrate polishing device and method.
  32. Obeng, Yaw S.; Yokley, Edward M., Thermal management with filled polymeric polishing pads and applications therefor.
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