초록 ▼

In a cooling body (1) which has, in the semiconductor supporting surfaces illustrated, cooling slits (3) which are connected via two connecting channels (4) to a collecting channel (7) for the supply of a cooling liquid, for example oil, cooling elements (9) are provided at the edge to improve the c

In a cooling body (1) which has, in the semiconductor supporting surfaces illustrated, cooling slits (3) which are connected via two connecting channels (4) to a collecting channel (7) for the supply of a cooling liquid, for example oil, cooling elements (9) are provided at the edge to improve the cooling effect. These cooling elements can be designed as cooling ribs, cooling fingers or cooling needles. The cooling liquid flows out of the cooling slits (3) at an angle (a1) and between the cooling elements (9) of the latter and thereby dissipates heat from the cooling body and from the cooling elements. The cooling slits can extend radially, widening outwards, or in serpentine or involute form or spirally and can have a rectangular or triangular or semi-circular or trapezoidal cross-section.

대표청구항 ▼

A cooling body for the liquid cooling of at least one high-power semiconductor component, said cooling body having: (a) at least one semi-conductor supporting surface; (b) a plurality of cooling elements located at the edge of said cooling body; (c) a collecting channel for cooling liquid formed in

A cooling body for the liquid cooling of at least one high-power semiconductor component, said cooling body having: (a) at least one semi-conductor supporting surface; (b) a plurality of cooling elements located at the edge of said cooling body; (c) a collecting channel for cooling liquid formed in said cooling body, said collecting channel having an upstream end and a downstream end, the downstream end of said collecting channel being in fluid communication with said at least one supporting surface; and (d) at least one cooling slit formed in said semi-conductor supporting surface, said at least one cooling slit having an upstream end and a downstream end, the upstream end of said at least one cooling slit being in fluid communication with the downstream end of said collecting channel and the downstream end of said at least one cooling slit forming a free liquid outflow orifice adjacent said at least one semi-conductor supporting surface, the outflow angle (a40°to 90°, said outflow angle (a