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An improved package for a semiconductor device comprises an integrated circuit die and a mounting package having an array of parallel leads which directly connect perpendicular to the die. The process for making the package comprises forming an array of parallel, spaced apart, conductor pins; bondin

An improved package for a semiconductor device comprises an integrated circuit die and a mounting package having an array of parallel leads which directly connect perpendicular to the die. The process for making the package comprises forming an array of parallel, spaced apart, conductor pins; bonding the array of parallel conductor pins directly to an integrated circuit die while maintaining the die in a plane perpendicular to the parallel pins; and surrounding the die with a package material capable of protecting the die.

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A method for making a semiconductor device comprising an integrated circuit die and a mounting package including leads to interconnect the die with external electrical components, said process comprising: (a) forming an array of parallel conductor pins equidistantly spaced apart hexagonal to one ano

A method for making a semiconductor device comprising an integrated circuit die and a mounting package including leads to interconnect the die with external electrical components, said process comprising: (a) forming an array of parallel conductor pins equidistantly spaced apart hexagonal to one another to provide enhanced spacing; (b) bonding the array of parallel conductor pins directly to an array of contact pads formed on an integrated circuit die in registry with said pin array while maintaining said die in a plane perpendicular to said parallel pins; and (c) surrounding said die with a package material capable of protecting said die.