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A vacuum pick suitable for removing semiconductor wafers from and replacing wafers in a cassette holder. The vacuum pick includes a thin profile housing having a wafer support surface with a cavity therein, a resilient, flexible member covering a portion of the cavity to form an enclosure, and a rig

A vacuum pick suitable for removing semiconductor wafers from and replacing wafers in a cassette holder. The vacuum pick includes a thin profile housing having a wafer support surface with a cavity therein, a resilient, flexible member covering a portion of the cavity to form an enclosure, and a rigid chuck mounted on the flexible member so as to permit movement of the chuck relative to the housing. The chuck includes a wafer-receiving surface connected through a passage to the enclosure. When a vacuum is applied to the enclosure, the wafer and the chuck are retracted against the housing and held firmly in place. The chuck tilts relative to the housing when it contacts a tilted wafer, thereby insuring reliable attachment to the wafer.

대표청구항 ▼

A vacuum pick comprising: a housing having a workpiece support surface with a cavity therein; a resilient flexible member covering at least a portion of the cavity to form an enclosure; a rigid chuck mounted on the flexible member to permit movement of the chuck relative to the housing, the chuck ha

A vacuum pick comprising: a housing having a workpiece support surface with a cavity therein; a resilient flexible member covering at least a portion of the cavity to form an enclosure; a rigid chuck mounted on the flexible member to permit movement of the chuck relative to the housing, the chuck having a substantially flat surface portion for receiving a workpiece; vacuum source means connected to the enclosure, the chuck and the flexible member having a passage therethrough providing a fluid connection between the surface portion of the chuck and the enclosure, the chuck having an extended position when vacuum is not applied to the enclosure and a retracted position when vacuum is applied to the enclosure, the workpiece being drawn against the support surface of the housing when the chuck is in the retracted position.