초록 ▼

Security film comprising a monolayer of transparent microspheres supported in a thin layer of binder material, a pressure-sensitive adhesive layer coated on the layer of binder material, and disposed between the pressure-sensitive adhesive and binder layers, at least one patterned layer that has dif

Security film comprising a monolayer of transparent microspheres supported in a thin layer of binder material, a pressure-sensitive adhesive layer coated on the layer of binder material, and disposed between the pressure-sensitive adhesive and binder layers, at least one patterned layer that has differential adhesion to the pressure-sensitive adhesive layer and the binder layer such that upon attempted elevated-temperature removal of the film from a substrate the film splits, with part of the film remaining on the substrate and part being removed.

대표청구항 ▼

A security film comprising a monolayer of transparent microspheres supported in a thin layer of binder material, the binder materuial comprising an acrylic low-molecular-weight polymer soluble in a nonpolar solvent; a pressure-sensitive adhesive coated onto the binder material; and at least a first

A security film comprising a monolayer of transparent microspheres supported in a thin layer of binder material, the binder materuial comprising an acrylic low-molecular-weight polymer soluble in a nonpolar solvent; a pressure-sensitive adhesive coated onto the binder material; and at least a first patterned layer disposed between the pressure-sensitive adhesive and binder material layers and covering a portion of the interface between the two layers, said patterned layer comprising either (a) a dye having lower adhesion to the binder material than to the pressure-sensitive adhesive such that upon exposure of the complete film to an elevated temperature of 100°C. or more, the pressure-sensitive adhesive separates from the binder material in areas covered by the dye or (b) a nonpolar thermoplastic resin promoting adhesion between the binder material and pressure-sensitive adhesive such that upon exposure of the complete film to an elevated temperature of 100°C. or more, the pressure-sensitive adhesive tends to remain adhered to the binder material in areas covered by the adhesion-promoting resin.