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Process for removing covering film and apparatus therefor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03C-011/24
  • B24B-001/00
  • B24C-001/00
  • B08B-007/00
출원번호 US-0711475 (1985-03-13)
발명자 / 주소
  • Hayashi Chikara (Chigasaki JPX)
출원인 / 주소
  • Research Development Corporation of Japan (Tokyo JPX 03)
인용정보 피인용 횟수 : 46  인용 특허 : 3

초록

A process for removing covering films by blowing CO2 particles against the film. Fine ice particles may be mixed with the CO2 particles.

대표청구항

A process for removing a covering film from a surface of a substrate wherein CO2 particles, produced in an air-tight sealed chamber, are blown from a jet nozzle by N2 gas, said CO2 particles being introduced into a treatment chamber against a covering film applied to the surface of the substrate.

이 특허에 인용된 특허 (3)

  1. Fong Calvin C. (Beverly Hills CA) Altizer John W. (Simi Valley CA) Arnold Vernon E. (Fillmore CA) Lawson John K. (Granada Hills CA), Blasting machine utilizing sublimable particles.
  2. Nakamura Shohei (Fuji JPX) Kinoshita Nobuyasu (Tokyo JPX), Dry process for forming an image.
  3. Fong Calvin C. (Beverly Hills CA), Sandblasting with pellets of material capable of sublimation.

이 특허를 인용한 특허 (46)

  1. Rose Peter H. ; Sferlazzo Piero ; van der Heide Robert G., Aerosol surface processing.
  2. Rose Peter H. ; Sferlazzo Piero ; van der Heide Robert G., Aerosol surface processing.
  3. Jeong,Chul, Apparatus and method of removing particles.
  4. Bran,Mario E., Apparatus for megasonic processing of an article.
  5. Goenka Lakhi Nandlal (Ann Arbor MI), CO2 cleaning nozzle and method with enhanced mixing zones.
  6. Goenka Lakhi N. (Ann Arbor MI), CO2 nozzle and method for cleaning pressure-sensitive surfaces.
  7. Olevitch Albert (Englewood OH), Cryogenic mechanical means of paint removal.
  8. McCune ; Jr. Robert C. (Birmingham MI) Toth Louis (Garden City MI) Bailey Robert S. (Newport News VA), Cryogenic process for metal lift-off.
  9. Becker David Scott ; Hanestad Ronald J. ; Thomes Gregory P. ; Weygand James F. ; Zimmerman Larry D., Eliminating stiction with the use of cryogenic aerosol.
  10. Zajac John (1137 Angmar Ct. San Jose CA 95121), Flame ashing process and apparatus for stripping photoresist.
  11. Zajac John (1137 Angmar Ct. San Jose CA 95121), Flame ashing process for stripping photoresist.
  12. Jon Min-Chung (Princeton Junction NJ) Nicholl Hugh (Berthoud CO) Read Peter Hartpence (Morrisville PA), Method and apparatus for CO2 cleaning with mitigated ESD.
  13. Bjornard Erik J. (Northfield MN) Kurman Eric W. (Northfield MN) Shogren David A. (Lakeville MN) Hoffman Jeffrey J. (Inver Grove Heights MN), Method and apparatus for cleaning substrates in preparation for deposition of thin film coatings.
  14. Rufin Denis A. (Hinsdale IL), Method and apparatus for in situ cleaning of excimer laser optics.
  15. Yam Benny S. ; Colbert Kenneth S., Method for cleaning electronic hardware components.
  16. Bran, Mario E., Method for megasonic processing of an article.
  17. Hans Kramer DE; Matthias Taubert DE; Gernot Loibnegger DE, Method for regenerating semiconductor wafers.
  18. Charles W. Bowers, Method for selective metal film layer removal using carbon dioxide jet spray.
  19. Bran,Mario E., Method of cleaning a side of a thin flat substrate by applying sonic energy to the opposite side of the substrate.
  20. Bran, Mario E., Method of manufacturing integrated circuit devices.
  21. Stevens, Blake; Sorenson, Max, Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture.
  22. Yoon, Cheol-Nam, Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface.
  23. Yoon,Cheol Nam, Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface.
  24. Lloyd Daniel L. (Mason OH), Phase change injection nozzle.
  25. Rose Peter H. ; Sferlazzo Piero, Processing a surface.
  26. Tada Masuo (Yao JPX) Hata Takeki (Kobe JPX) Fukumoto Takaaki (Itami JPX) Ohmori Toshiaki (Itami JPX), Processing apparatus for semiconductor wafers.
  27. Tada, Masuo; Hata, Takeki; Fukumoto, Takaaki; Ohmori, Toshiaki, Processing method for semiconductor wafers.
  28. Astle, David J.; Child, Tyler C.; Kasagani, Vimal K.; Loose, Cameron L.; Stevens, Blake L.; Sorenson, Max E., Removal of selected portions of protective coatings from substrates.
  29. Astle, David James; Child, Tyler Christensen; Kasagani, Vimal Kumar; Loose, Cameron LaMar; Stevens, Blake LeRoy; Sorenson, Max Ernest, Removal of selected portions of protective coatings from substrates.
  30. Miki, Nobuhiro; Nitta, Takahisa, Resist film removal apparatus and resist film removal method.
  31. Meuer, Gary D., Supersonic fan nozzle for abrasive blasting media.
  32. DePalma, Philip W.; Sherman, Robert, System and method for controlling humidity in a cryogenic aerosol spray cleaning system.
  33. Kim, Se-Ho, System for forming aerosols and cooling device incorporated therein.
  34. Kim,Se Ho, System for forming aerosols and cooling device incorporated therein.
  35. Bran, Mario E., System for megasonic processing of an article.
  36. Stevens, Blake; Sorenson, Max; Gordon, Scott B., System for refurbishing or remanufacturing an electronic device.
  37. Cates Michael C. ; Hamm Richard R. ; Hoogerwerl John D. ; Lewis Michael W. ; Schmitz Wayne N., System for removing a coating from a substrate.
  38. Bran,Mario E., Transducer assembly for megasonic processing of an article and apparatus utilizing the same.
  39. Patrin John C. ; Heitzinger John M., Treating substrates by producing and controlling a cryogenic aerosol.
  40. Cousin, Franck; Frederick, Willy; Fachon, Nicolas, Use of a mixture of carbon dioxide snow and liquid nitrogen in quick freezing applications.
  41. Bran, Mario E., Wafer cleaning.
  42. Bran, Mario E., Wafer cleaning.
  43. Bran Mario E., Wafer cleaning method.
  44. Mario E. Bran, Wafer cleaning method.
  45. Bran Mario E., Wafer cleaning system.
  46. Bran Mario E., Wafer cleaning system.
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