초록 ▼

An integrated circuit package for high density applications comprises spring contacts on one face thereof for its removable mounting onto a printed circuit board, the mounting being accomplished by means of a frame assembly and the package being automatically fabricable in a continuous flow process

An integrated circuit package for high density applications comprises spring contacts on one face thereof for its removable mounting onto a printed circuit board, the mounting being accomplished by means of a frame assembly and the package being automatically fabricable in a continuous flow process involving its assembly on a transport tape and its final cutting therefrom.

대표청구항 ▼

An integrated circuit packaging system, including an integrated circuit package which comprises; a planar carrier comprising first and second surfaces, said first surface being adapted for having an integrated circuit affixed thereto, a lid for enclosing said integrated circuit against said first su

An integrated circuit packaging system, including an integrated circuit package which comprises; a planar carrier comprising first and second surfaces, said first surface being adapted for having an integrated circuit affixed thereto, a lid for enclosing said integrated circuit against said first surface, a plurality of electrical connections for connecting said integrated circuit to said first surface, a plurality of electrical conductors for continuing said electrical connections from said first to said second surface, and, a plurality of elastic contact springs, affixed to project below said second surface, electrically connected to said plurality of conductors, and compressible to press against external contacts to provide electrical connection between an external circuit and said integrated circuit.