초록 ▼

A circuit board is manufactured from a core layer having a conductor run layer overlying the core layer on one side thereof, and a continuous layer of dielectric material overlying the conductor run layer, by forming a continuous outer layer of conductive material over the layer of dielectric materi

A circuit board is manufactured from a core layer having a conductor run layer overlying the core layer on one side thereof, and a continuous layer of dielectric material overlying the conductor run layer, by forming a continuous outer layer of conductive material over the layer of dielectric material. Material of the continuous outer layer is removed at a predetermined location, and the dielectric material that is thus exposed is also removed so as to form an opening through which the conductor run layer is exposed. Conductive material is deposited into the opening to at least the level of the outer conductor layer, whereby the conductor run layer is connected to the outer layer of conductive material.

대표청구항 ▼

A method of manufacturing a circuit board, comprising forming a conductor run layer on one face of a core layer, depositing a layer of dielectric material over the conductor run layer, depositing an outer layer of conductive material over the layer of dielectric material, locally removing material o

A method of manufacturing a circuit board, comprising forming a conductor run layer on one face of a core layer, depositing a layer of dielectric material over the conductor run layer, depositing an outer layer of conductive material over the layer of dielectric material, locally removing material of the outer layer so as to expose the dielectric material, removing the exposed dielectric material so as to form an opening through which the conductor run layer is exposed, and depositing conductive material into said opening so as to establish electrical connection between the conductor run layer and the outer layer of conductive material.