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A conductivity-type sensor, typically for use in a wafer sorting system, for detecting the conductivity-type of semiconductor wafers. In measuring conductivity, a two-contact probe is applied to the semiconductor wafer and any static charge which may have been accumulated on the wafer is initially d

A conductivity-type sensor, typically for use in a wafer sorting system, for detecting the conductivity-type of semiconductor wafers. In measuring conductivity, a two-contact probe is applied to the semiconductor wafer and any static charge which may have been accumulated on the wafer is initially discharged at an accelerated rate. The charge state is measured and an acceptable level of discharge requires repeated indications of discharge below a predetermined level. Discharging and charge measurement is repeated a predetermined number of times as necessary to accomplish discharging or the wafer identified as defective. The conductivity-type of the discharged wafer is read from the rectified polarity of an oscillating signal applied to the contacts. A valid indication of conductivity-type requires two consecutive readings of the same conductivity-type. The consecutive readings can be either the first reading of a new wafer identical with the reading of a previous wafer or two consecutive identical readings on the same wafer. Each reading, to be considered an acceptable reading of conductivity-type requires five consecutive, identical conductivity measurements over a predetermined time interval. Failure of such criteria produces a wafer defect indication.

대표청구항 ▼

A semiconductor wafer conductivity-type detector system comprising: contacts for providing electrical and mechanical contact with a wafer and including an axially extending sharp tip portion adapted to provide such contact; means for selectively applying said contacts to a location on a semiconducto

A semiconductor wafer conductivity-type detector system comprising: contacts for providing electrical and mechanical contact with a wafer and including an axially extending sharp tip portion adapted to provide such contact; means for selectively applying said contacts to a location on a semiconductor wafer; said contacts including an axially extending and sharp tip portion of greater hardness than said wafer which tip portion contacts said wafer at said location; means for sensing charge across said contacts as applied to said wafer whereby wafer charge is measured at said location; means for providing accelerated discharge through said contacts of the wafer charge at said location as sensed across said contacts by applying a charge having a polarity opposite the polarity of the charge sensed across said contacts; and means for determining wafer conductivity type of a discharged wafer through said contacts at said location.