초록 ▼

A method is provided for acid etching or sandblasting decorative designs in the smooth surface of hard substrates such as glass, ceramics, plastics, and marble, granite, or other stones. A dry film photoresist, preferably a solder mask, is applied to the smooth surface without the addition of heat.

A method is provided for acid etching or sandblasting decorative designs in the smooth surface of hard substrates such as glass, ceramics, plastics, and marble, granite, or other stones. A dry film photoresist, preferably a solder mask, is applied to the smooth surface without the addition of heat. The decorative design is placed on the dry film by exposing the dry film to ultraviolet light through a negative of the design to place the design on the surface of the photoresist. The dry film is then developed to remove a portion of it. The smooth surface is then acid etched or sandblasted, with the portion of the dry film remaining on the smooth surface protecting that portion of the smooth surface from the acid etching or sandblasting process. An apparatus is also provided for applying the dry film photoresist to the substrate.

대표청구항 ▼

A method of forming a design in relief in the smooth surface of a hard substrate comprising the steps of: (a) removing the polyethylene release layer from a laminated sheet of dry film photoresist; (b) applying the remaining layers of the dry film photoresist at ambient temperature to the smooth sur

A method of forming a design in relief in the smooth surface of a hard substrate comprising the steps of: (a) removing the polyethylene release layer from a laminated sheet of dry film photoresist; (b) applying the remaining layers of the dry film photoresist at ambient temperature to the smooth surface of the hard substrate with the photopolymer layer of the dry film photoresist directly contacting the smooth surface; (c) placing a negative of the design on top of the dry film photoresist coated smooth surface, the negative having dark and transparent areas; (d) exposing the dry film photoresist through the transparent areas of the negative to an intensity of ultraviolet light for a period of time only sufficient to place the design on the dry film photoresist by polymerizing only the surface of the photopolymer layer; (e) removing the protective polyester layer of the dry film photoresist, leaving the photopolymer layer on the substrate; (f) removing from the smooth surface a portion of the photopolymer layer in the shape of the design by spraying the photopolymer layer with developer solution to remove the portions of the photopolymer layer which were behind the dark areas of the negative during exposure; (g) removing the smooth surface of the hard substrate to a desired depth over the area of the smooth surface where the photopolymer layer has been removed; and (h) removing the remaining portion of the photopolymer layer.