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Directional accelerometer and its microlithographic fabrication process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01P-015/125
출원번호 US-0686902 (1984-12-27)
우선권정보 FR-0000414 (1984-01-12)
발명자 / 주소
  • Danel Jean-Sebastien (Grenoble FRX) Delapierre Gilles (Seyssinet FRX) Michel France (Sassenage FRX)
출원인 / 주소
  • Commissariat a l\Energie Atomique (Paris FRX 07)
인용정보 피인용 횟수 : 74  인용 특허 : 5

초록

A directional accelerometer and a process for the microlithographic fabrication of such an accelerometer. The accelerometer includes a substrate having at least one recess to define at least one beam in the substrate. One of the ends of the beam is integrally formed with the remainder of the substra

대표청구항

A monodirectional accelerometer for measuring one component of an acceleration of a moving body, comprising: a substrate formed of a material and having at least one recess; at least one parallelepipedic beam placed in the recess and having a first end which is integral with said substrate, said bea

이 특허에 인용된 특허 (5)

  1. Holdren ; Frederick V. ; Hugli ; Hans W. ; Kubler ; John M. ; Larson ; M artin E. ; Van Schoiack ; Michael M., Accelerometer.
  2. Rudolf Felix (Cortaillod CHX), Accelerometer.
  3. Petersen Kurt E. (San Jose CA) Shartel Anne C. (San Jose CA), Planar semiconductor three direction acceleration detecting device and method of fabrication.
  4. Hansson, Jan I., Silicon accelerometer.
  5. Youmans Albert P. (Cupertino CA), Solid state force transducer, support and method of making same.

이 특허를 인용한 특허 (74)

  1. Fujii Tetsuo (Toyohashi JPX) Itoh Osamu (Kariya JPX), Acceleration detecting apparatus formed by semiconductor.
  2. Wakatsuki Noboru (Kawasaki JPX) Kurashima Shigemi (Kawasaki JPX) Shimizu Nobuyoshi (Yokohama JPX) Endoh Michiko (Yokohama JPX) Tanaka Akira (Kawasaki JPX), Acceleration sensor.
  3. Fujii Tetsuo,JPX, Acceleration sensor and process for the production thereof.
  4. Fujii Tetsuo,JPX, Acceleration sensor and process for the production thereof.
  5. Fujii Tetsuo,JPX, Acceleration sensor and process for the production thereof.
  6. Fujii, Tetsuo, Acceleration sensor and process for the production thereof.
  7. Fujii, Tetsuo, Acceleration sensor and process for the production thereof.
  8. Fujii,Tetsuo, Acceleration sensor and process for the production thereof.
  9. Fujii,Tetsuo, Acceleration sensor and process for the production thereof.
  10. Henschel Mark E. ; Hall David Brian ; Sleeper Scott B. ; Larson Lary R. ; Child Brian S. ; Malone Patrick F. ; Haq Samuel F. ; Ruben David A. ; O'Gara Joan A. ; Volmering James E. ; Inman Roy L., Accelerometer for implantable medical device.
  11. Legay Thierry,FRX, Active implantable medical device enslaved to a signal of acceleration.
  12. McAlexander, III, Joseph Colby, Bi-directional released-beam sensor.
  13. McAlexander, III,Joseph Colby, Bi-directional released-beam sensor.
  14. Greiff Paul (Wayland MA) Bernstein Jonathan J. (Medfield MA), Bridge electrodes for microelectromechanical devices.
  15. MacDonald Noel C. (Ithaca NY) Bertsch Fred M. (Ithaca NY) Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY), Capacitance based tunable micromechanical resonators.
  16. Greiff Paul, Capacitive in-plane accelerometer.
  17. El-Gamal, Mourad; Elsayed, Mohannad; Cicek, Paul-Vahe; Nabki, Frederic, Combined magnetometer accelerometer MEMS devices and methods.
  18. Corkum David L. ; Park June, Condition responsive sensor.
  19. Despesse, Ghislain; Chaillout, Jean-Jacques; Jager, Thomas, Device with optimised capacitive volume.
  20. Fujii, Tetsuo, Dynamic amount sensor and process for the production thereof.
  21. Masahito Mizukoshi JP, Dynamical quantity sensor.
  22. Mizukoshi Masahito,JPX, Dynamical quantity sensor.
  23. Dietrich Klaus (Stockdorf DEX) Kroy Walter (Ottobrunn DEX), Electric transducer for measuring mechanical quantities.
  24. Greiff Paul (Wayland MA) Boxenhorn Burton (Chestnut Hill MA), Electromagnetic rebalanced micromechanical transducer.
  25. Greiff Paul (Wayland MA) Antkowiak Bernard M. (Oxford MA), Gimballed vibrating wheel gyroscope having strain relief features.
  26. Weinberg Marc S. ; Pinson John C., Guard bands which control out-of-plane sensitivities in tuning fork gyroscopes and other sensors.
  27. Sikorski James M. ; Ruben David A., High output sensor and accelerometer for implantable medical device.
  28. Sikorski James M. ; Ruben David A., High output sensor and accelerometer implantable medical device.
  29. Weinberg, Marc S.; Bancu, Mirela G.; Bickford, James A.; Bernstein, Jonathan J.; Elliott, Richard, High performance sensors and methods for forming the same.
  30. Aaron Partridge ; Alissa M. Fitzgerald ; Benjamin W. Chui ; Jospeh Kurth Reynolds ; Thomas W. Kenny, In-plane micromachined accelerometer and bridge circuit having same.
  31. Goglio Luigi,ITX, Installation for packaging coffee.
  32. Blanchard,Richard A.; McAlexander,Joseph C., Integrated released beam layer structure fabricated in trenches and manufacturing method thereof.
  33. Fujii Tetsuo (Toyohashi JPX) Imai Masahito (Chita JPX), Mechanical force sensing semiconductor device.
  34. Fujii Tetsuo,JPX ; Imai Masahito,JPX, Method for manufacturing a mechanical force sensing semiconductor device.
  35. Stewart,Robert E.; Denice, Jr.,Michae W., Method for modifying the location of nodal points of a vibrating beam.
  36. Tsang Robert W. K. (Bedford MA) Core Theresa A. (North Andover MA), Methods for fabricating monolithic device containing circuitry and suspended microstructure.
  37. Galvin Gregory J. ; Davis Timothy J. ; MacDonald Noel C., Microelectromechanical accelerometer for automotive applications.
  38. Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY) MacDonald Noel C. (Ithaca NY), Microelectromechanical lateral accelerometer.
  39. Robert,Philippe, Micromachined comb capacitive accelerometer.
  40. Robert,Philippe, Micromachined comb capacitive accelerometer.
  41. Galvin Gregory J. ; Davis Timothy J. ; MacDonald Noel C., Micromechanical accelerometer for automotive applications.
  42. MacDonald Noel C. ; Shaw Kevin A. ; Adams Scott G., Micromechanical accelerometer for automotive applications.
  43. Greiff Paul, Micromechanical accelerometer having a peripherally suspended proof mass.
  44. Moore David Frank,GB2 ; Hoole Andrew Charles Frederick,GB2 ; Heaver Alan,GB2, Micromechanical sensor.
  45. Shaw Kevin A. ; Zhang Z. Lisa ; MacDonald Noel C., Microstructures and single mask, single-crystal process for fabrication thereof.
  46. Tsang Robert W. K. ; Core Theresa A. ; Sherman Steven J. ; Brokaw A. Paul, Monolithic micromechanical apparatus with suspended microstructure.
  47. Tsang Robert W. K. ; Core Theresa A. ; Sherman Steven J. ; Brokaw A. Paul, Monolithic micromechanical apparatus with suspended microstructure.
  48. Greiff Paul, Monolithic micromechanical vibrating beam accelerometer with trimmable resonant frequency.
  49. Albert William C. (Boonton NJ), Monolithic resonator for a vibrating beam accelerometer.
  50. Holm-Kennedy James W. (Honolulu HI) Lee Gordon P. (Waipahu HI) Kaneshiro Michael H. (Pearl City HI), Multidimensional force sensor.
  51. Adams Scott G. ; Wang Yongmei Cindy ; Macdonald Noel C. ; Thorp James S., Multistable tunable micromechanical resonators.
  52. Henschel Mark E. (Phoenix AZ) Milla Juan G. (Mesa AZ) Consoer Kelly J. (Chandler AZ) Sikorski James M. (Moundsview MN) Larson Larry R. (Chandler AZ), Packaged integrated accelerometer.
  53. Greiff Paul, Process for micromechanical fabrication.
  54. Diem Bernard (Chirolles FRX) Delaye Marie-Therese (Grenoble FRX), Process for the production of accelerometers using silicon on insulator technology.
  55. Sickafus Edward N. (Grosse Ile MI), Rectilinearly deflectable element fabricated from a single wafer.
  56. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  57. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  58. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  59. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  60. Fujii, Tetsuo; Imai, Masahito, Semiconductor mechanical sensor.
  61. Fujii,Tetsuo; Imai,Masahito, Semiconductor mechanical sensor.
  62. Fujii,Tetsuo; Imai,Masahito, Semiconductor mechanical sensor.
  63. Masahito Imai JP, Semiconductor mechanical sensor.
  64. Tetsuo Fujii JP; Masahito Imai JP, Semiconductor mechanical sensor.
  65. Fujii Tetsuo,JPX ; Imai Masahito,JPX, Semiconductor mechanical sensor and method of manufacture.
  66. Kazuhiko Kano JP; Junji Ohara JP; Nobuyuki Ohya JP, Semiconductor physical quantity sensor and method of manufacturing the same.
  67. Brun Jean,FRX ; Danel Jean-Sebastien,FRX, Sensor, in particular accelerometer, and actuator with electric insulation localised in a substrate plate.
  68. Ruben David A. ; Henschel Mark E. ; Larson Larry R. ; Inman Roy ; Molinari Louis A. ; O'Gara Joan A. ; Messer Ronald F., Shock resistant accelerometer for implantable medical device.
  69. Mikkor Mati (Ann Arbor MI), Silicon accelerometer responsive to three orthogonal force components and method for fabricating.
  70. Roszhart Terry V. (North Caldwell NJ), Silicon micromachined accelerometer.
  71. Ward Paul A. ; Hildebrant Eric M. ; Niles Lance C. ; Weinberg Marc S. ; Kourepenis Anthony S., Split electrode to minimize charge transients, motor amplitude mismatch errors, and sensitivity to vertical translation.
  72. Weinberg Marc S. ; Ward Paul A. ; Kourepenis Anthony S., Temperature insensitive silicon oscillator and precision voltage reference formed therefrom.
  73. Weinberg Marc S. ; Cho Steven T. ; Hopkins ; III Ralph E. ; Niles Lance C. ; Kourepenis Anthony S. ; Hildebrant Eric M. ; Ward Paul A., Trenches to reduce charging effects and to control out-of-plane sensitivities in tuning fork gyroscopes and other sensor.
  74. McAlexander, III,Joseph Colby, Weighted released-beam sensor.
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