$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색도움말
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

통합검색

도움말도움말
상세검색 다국어 입력

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Dielectric composition

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B32B-018/00   
미국특허분류(USC) 156/89 ; 156/242 ; 156/246 ; 501/15
출원번호 US-0715971 (1985-03-25)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 44  인용 특허 : 10
초록

A dielectric composition comprising an admixture of finely divided solids comprising (a) a noncrystallizable glass of which the deformation temperature (Td) is 580°-625°C. and the softening point (Ts) is 630°-700°C., and (Ts-Td) is 50°-75°C., and (b) a refractory which is substantially insoluble in the glass at temperatures of 825°-900°C.

대표
청구항
▼

A castable dielectric composition comprising a dispersion of finely divided solids comprising: (a) 50-75% wt. noncrystallizable glass of which the deformation temperature (Td) is 580°-625°C. and the softening point (Ts) is 630°-700°C. and (Ts-Td) is 50°-75°C. (b) 50-25% wt. refractory which is substantially insoluble in the glass at temperatures of 825°-900°C., the refractory and glass solids being selected from the group consisting of Al2O3, mullite, cordierite, SiO2, CaZrO3, forsterite, ZrO2 and mixtures thereof both dispersed in a solution of (c) an o...

이 특허에 인용된 특허 (10)

  1. Swiss William R. (Bloomfield NJ) Young Wayne S. (Poughkeepsie NY). Accelerated sintering for a green ceramic sheet. USP1979054153491.
  2. Anderson ; Leslie C. ; Nufer ; Robert W. ; Pugliese ; Frank G.. Ceramic dielectrics. USP1978034080414.
  3. Anderson ; Leslie C. ; Nufer ; Robert W. ; Pugliese ; Frank G.. Ceramic dielectrics. USP1978084104345.
  4. Muller Gerd (Mainz-Weisenau DEX). Glass composition for passivating semiconductor surfaces. USP1979014133690.
  5. Kumar Ananda H. (Wappingers Falls NY) McMillan Peter W. (Leamington Spa NY GB2) Tummala Rao R. (Wappingers Falls NY). Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper. USP1981114301324.
  6. Smith Robert D. (1105 Currituck Dr. Raleigh NC 27609) Upchurch William B. (Rte. 1 Wake Forest NC 27587). PROCESS FOR FORMING THIN WALLED ARTICLES OR THIN SHEETS. USP1976103988405.
  7. Eggerding Carl L. (Wappingers Falls NY) Gonzales ; Jr. Frank (Poughkeepsie NY) Niklewski Jerzy B. (Wappingers Falls NY). Process for forming mullite. USP1981064272500.
  8. Smiley Leonard H. (Jenkintown PA) Tigelaar Howard L. (Levittown PA). Process for preparing highly filled acrylic articles. USP1980014183991.
  9. Schmank Horst W. (Ringold GA). Rigidly bonded green ceramics and processes. USP1976063962162.
  10. Greenstein Bernard (Toledo OH). Vehicle and printing pastes for use in the manufacture of microelectronic packages. USP1976083975201.

이 특허를 인용한 특허 피인용횟수: 44

  1. Jean Jau-Ho (Export PA) Gupta Tapan K. (Monroeville PA). Aluminum borate devitrification inhibitor in low dielectric borosilicate glass. USP1993125270268.
  2. Bethke Shelly J. ; Miesem Ross A. ; Chiou Wayne W. ; Pastor Rickey G.. Ceramic composition. USP1998105821181.
  3. Bethke Shelly J. ; Miesem Ross A. ; Chiou Wayne W. ; Pastor Rickey G.. Ceramic composition and method of making same. USP2000106133175.
  4. Jean Jau-Ho,TWX ; Lin Shih-Chun,TWX. Ceramic dielectric compositions. USP2001016174829.
  5. Lin Shih-Chun,TWX ; Jean Jau-Ho,TWX. Ceramic dielectric compositions. USP2000126159883.
  6. Klee Mareike,DEX ; Brand Wolfgang,DEX ; Hermann Wilhelm,DEX ; Ulenaers Mathieu J. E.,BEX ; Spierings Gijsbertus A. C. M.,NLX ; Van Haren Hendrikus J. J. M.,NLX. Component comprising a capacitor. USP2000096125027.
  7. Hartmann Hans S. (Wilmington DE). Crystallizable, low dielectric constant, low dielectric loss composition. USP1991065024975.
  8. McCormick Cornelius J. (Hockessin DE). Dielectric composition. USP1989074849379.
  9. Senkalski Robert E. (North Wales PA) Hasenmayer Donald L. (North Wales PA). Dielectric composition having controlled thermal expansion. USP1990104961998.
  10. Watanabe Hiromitsu,JPX ; Oshita Hiroyuki,JPX ; Ohji Masahiko,JPX ; Hadano Kazuo,JPX. Dielectric forming material for use in plasma display panel and glass powder used therefor. USP2000016010973.
  11. Martin, Tom O.. Electrical switch device and process for manufacturing same. USP2003106639508.
  12. Taga Shigeru,JPX ; Takahashi Hiroyuki,JPX ; Yoshida Yoshitaka,JPX. Glass-ceramic composition, circuit substrate using the same and manufacture method thereof. USP2001036207905.
  13. Burn Ian (Hockessin DE). Low Dielectric constant compositions. USP1989114879261.
  14. Burn Ian (9 Pierson Dr. R.D. 1 Hockessin DE 19707). Low dielectric constant compositions. USP1990064935844.
  15. Wang, Carl B.; Kao, Shih Ming; Lin, Yu Cheng; Cheng, Jaw Shin. Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof. USP2009067550319.
  16. Wang, Carl B.; Kao, Shih-Ming; Lin, Yu-Cheng; Cheng, Jaw-Shin. Low temperature co-fired ceramic (LTCC) tape compositions, light-emitting diode (LED) modules, lighting devices and methods of forming thereof. USP2010107808097.
  17. Gantzhorn ; Jr. John E. (Hockessin DE) Nann Steven R. (Newark DE). Method for fabricating multilayer circuits. USP1991045006182.
  18. Rellick Joseph R. (Wilmington DE). Method for fabricating multilayer circuits. USP1989024806188.
  19. Lee,Wen Hsi; Su,Che Yi; Lee,Chun Te. Method for reducing shrinkage during sintering low-temperature-cofired ceramics. USP2008067381283.
  20. Nakatani Seiichi (Neyagawa JPX) Nishimura Tsutomu (Uji JPX) Yuhaku Satoru (Ikuno JPX) Ishida Toru (Hirakata JPX). Method of manufacturing a multilayer ceramic body. USP1989014795512.
  21. Murata Michihiro (Nagaokakyo JPX) Mandai Harufumi (Nagaokakyo JPX) Naito Yasuyuki (Nagaokakyo JPX). Method of manufacturing an LC composite component. USP1991024990202.
  22. Lautzenhiser, Frans P.; Amaya, Edmar M.; Hochheimer, J. Thomas. Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronics. USP2005096949156.
  23. Nair, Kumaran Manikantan; Gordon, Scott E; McCombs, Mark Frederick. Mixed-metal system conductors for LTCC (low-temperature co-fired ceramic). USP2014048704105.
  24. Nair, Kumaran Manikantan; Gordon, Scott E; McCombs, Mark Frederick. Mixed-metal system conductors for use in low-temperature co-fired ceramic circuits and devices. USP2016049307649.
  25. Lee, Wen-Hsi; Su, Che-Yi; Ling, Yi-Jung. Multilayer ceramic composition. USP2005056893710.
  26. Aoki Shigenori (Atsugi JPX) Imanaka Yoshihiko (Atsugi JPX). Multilayer ceramic copper circuit board. USP1990074939021.
  27. Shannon Joseph W. (Kent OH). Overflow prevention for soft drink dispensers. USP1990094953751.
  28. Choi John Haetak ; Drysdale Neville Everton. Photosensitive ceramic compositions containing polycarbonate polymers. USP2001026194124.
  29. Lim Chung (Middleburg Hts. OH) Faust William D. (Aurora OH). Porcelain enameled metal substrates. USP1991035002903.
  30. Wang,Carl B.; Hang,Kenneth Warren; Needes,Christopher R.. Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure. USP2006067068492.
  31. Wang,Carl B.; Hang,Kenneth Warren; Needes,Christopher R.. Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure. USP2007027175724.
  32. Wang,Carl B.; Hang,Kenneth Warren; Needes,Christopher R.. Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure. USP2006067067026.
  33. Wang, Carl Baasun; Hang, Kenneth Warren; Needes, Christopher Roderick Stewart. Process for the constrained sintering of asymmetrically configured dielectric layers. USP2004126827800.
  34. Wang,Carl B.; Hang,Kenneth Warren; Needes,Christopher R.. Process for the constrained sintering of asymmetrically configured dielectric layers. USP2006057048993.
  35. Lautzenhiser, Frans P.; Amaya, Edmar M.; Hochheimer, J. Thomas. Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same. USP2004066743534.
  36. Moh Kyung H.. Tapes for heat sealing substrates. USP2001046218005.
  37. Drozdyk Lorri Potvin. Thick film composition for modifying the electrical properties of a dielectric layer. USP1998075780375.
  38. Wang, Yueli; Needes, Christopher R.; Ollivier, Patricia J.. Thick film conductor case compositions for LTCC tape. USP2010067731812.
  39. Wang,Yueli; Needes,Christopher R.; Ollivier,Patricia J.. Thick film conductor case compositions for LTCC tape. USP2007087261841.
  40. Wang,Yueli; Needes,Christopher R.; Ollivier,Patricia J.. Thick film conductor case compositions for LTCC tape. USP2007127303698.
  41. Nair, Kumaran Manikantan; McCombs, Mark Frederick. Thick film conductor compositions and the use thereof in LTCC circuits and devices. USP2009117611645.
  42. Ollivier, Patricia J.; Hang, Kenneth Warren. Thick film conductor paste composition for LTCC tape in microwave applications. USP2010067740725.
  43. Ollivier,Patricia J.; Hang,Kenneth Warren. Thick film conductor paste compositions for LTCC tape in microwave applications. USP2008027326367.
  44. Needes, Christopher R.; McCombs, Mark Frederick; Nair, Kumaran Manikantan. Thick film paste via fill composition for use in LTCC applications. USP2010057722732.

IPC 상위 출원인