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Continuous process for the manufacture of printed circuit boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B44C-001/22
  • B32B-031/08
출원번호 US-0825562 (1986-02-03)
발명자 / 주소
  • Eggers Eugene A. (Binghamton NY) Summa William J. (Endwell NY)
출원인 / 주소
  • IBM Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 23  인용 특허 : 6

초록

A continuous method for the manufacture of a circuit board wherein a coating of a solvent-free thermosetting resin is applied to the surface of a metal foil. The resin coated foil is advanced into contact with a reinforcing cloth sheet layer to form a foil/cloth assembly. The assembly is continuousl

대표청구항

A method for the continuous manufacture of a composite circit board which comprises the continuous steps of coating the surface of a metal foil with a layer of a liquid thermosetting resin free of a volatile solvent, heating the foil to a temperature below the curing temperature of the resin to furt

이 특허에 인용된 특허 (6)

  1. Uekita, Masakazu; Fushiki, Yasuo; Ooizumi, Masayuki, Continuous process for producing a metal clad laminate.
  2. Oizumi Masayuki (Kobe JPX) Uekita Masakazu (Kobe JPX) Goto Masana (Miki JPX) Azumi Ichiro (Ohtsu JPX) Uozumi Shoji (Kobe JPX) Abe Masaharu (Kobe JPX) Fushiki Yasuo (Takatsuki JPX) Isshiki Minoru (Kob, Continuous process for producing reinforced resin laminates.
  3. Oizumi, Masayuki; Uekita, Masakazu; Goto, Masana; Azumi, Ichiro; Uozumi, Shoji; Abe, Masaharu; Fushiki, Yasuo; Isshiki, Minoru; Kawasaki, Kunio, Continuous process for producing reinforced resin laminates.
  4. Holtzman Kenneth A. (Clifton NJ), Devices employing flexible substrates and method for making same.
  5. Hewitt ; Jr. Ralph W. (Houston TX), Heat curable polyepoxide-unsaturated aromatic monomer resin compositions.
  6. Held Kurt (Alte Str. 1 D-7218 Trossingen 2 DEX), Method of and apparatus for the continuous production of a copper-faced electrolaminate.

이 특허를 인용한 특허 (23)

  1. Lauffer,John M.; Markovich,Voya R.; Orband,James W.; Wilson,William E., Apparatus and method for making circuitized substrates in a continuous manner.
  2. Lauffer, John M.; Markovich, Voya R.; McNamara, Jr., James J.; Moschak, Peter A., Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner.
  3. Lauffer,John M.; Markovich,Voya R.; Orband,James W.; Wilson,William E., Apparatus for making circuitized substrates in a continuous manner.
  4. Sasaoka, Kenji; Ikegaya, Fumitoshi; Mori, Takahiro; Motomura, Tomohisa; Sato, Yoshizumi; Shibayama, Koichiro, Apparatus for manufacturing a wiring board.
  5. Patel, Vijay Balubhai; Huang, Hsin-Hong, Circuit board having an integrated circuit board connector and method of making the same.
  6. Achyuta Achari ; Brenda Joyce Nation ; Jay D Baker ; Lakhi Nandlal Goenka ; Mohan R. Paruchuri ; Vladimir Stoica, Cladded material construction for etched-tri-metal circuits.
  7. Belke ; Jr. Robert Edward ; McLeskey Edward P. ; Trublowski John ; Zitzmann Alice Dawn, Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same.
  8. Aijima, Masatoshi, Continuous molding method of composite material having stepwise sectional thickness.
  9. Okajima Kiyonori (Tokyo JPX) Saito Jugoro (Tokyo JPX) Fujiwara Hiroshi (Koshigaya JPX), Continuous press machine.
  10. Middelman Erik (Arnhem NLX), Continuous process for the manufacture of substrates for printed wire boards.
  11. Uno Tadao,JPX, Device for adhering protective film onto personal data recording surface of identification booklet.
  12. Pourmand Nasser ; Boyer John James, Lamination machine.
  13. Arnold August Petronella Marie d'Hondt NL, Laminator.
  14. Davis, Thomas J.; Desai, Subahu D.; Lauffer, John M.; McNamara, Jr., James J.; Markovich, Voya R., Method for making a multilayered circuitized substrate.
  15. Lauffer, John M.; Markovich, Voya R.; McNamara, Jr., James J.; Moschak, Peter A., Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner.
  16. Sasaoka,Kenji; Ikegaya,Fumitoshi; Mori,Takahiro; Motomura,Tomohisa; Sato,Yoshizumi; Shibayama,Koichiro, Method for manufacturing a wiring board.
  17. Sato,Tetsuro; Nagashima,Noriyuki, Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer.
  18. Johnston, Philip, Method of making a flexible circuit.
  19. Middelman Erik (Arnhem NLX) Zuuring Pieter Hendrik (Nijmegen NLX), Method of manufacturing a UD-reinforced PWB laminate.
  20. Zitzmann Klaus (Krefeld DEX), Method of the continuous production of circuit board structures.
  21. Bergstedt, Leif; Ligander, Per; Boustedt, Katarina, Printed board assembly and method of its manufacture.
  22. Noguchi Kazuo (Tokyo JPX), Process for producing copper-clad laminate.
  23. Rodenstein Larry M. ; Glines Bradley G. ; Amell Theodore, Zipper fusing machine for attaching zipper material to a plastic web.
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