초록 ▼

In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pa

In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bonding pad by said solder layer, the optical device chip is die-bonded in a stable state.

대표청구항 ▼

A package for an optical device, comprising: a sapphire substrate having an upper surface which has tapered portions which define tapered edges of a concave deformation in said upper surface; and a die bonding pad formed on said upper surface of said sapphire substrate by printing and burning electr

A package for an optical device, comprising: a sapphire substrate having an upper surface which has tapered portions which define tapered edges of a concave deformation in said upper surface; and a die bonding pad formed on said upper surface of said sapphire substrate by printing and burning electroconductive paste thereon; said electroconductive plaste being located on said tapered portions but not on said concave deformation thus leaving an opening in said die bonding pad so that light which passes through said sapphire substrate also passes through said opening.