초록 ▼

A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the co

A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts of the semiconductor chip. A plurality of transmission elements are located proximate the connector plate opposite from the semiconductor chip. A plurality of flexible conductors extend through the respective apertures of the connector plate. The flexible conductors are electrically coupled to the contacts of the chip and to the transmission elements.

대표청구항 ▼

A semiconductor chip module comprising: a semiconductor chip having an exposed front face with a two-dimensional array of contacts thereon; a connector plate immediately proximate the front face of the chip having a plurality of apertures corresponding to and aligned with the contacts on the semicon

A semiconductor chip module comprising: a semiconductor chip having an exposed front face with a two-dimensional array of contacts thereon; a connector plate immediately proximate the front face of the chip having a plurality of apertures corresponding to and aligned with the contacts on the semiconductor chip; a plurality of transmission means located proximate the connector plate opposite from the semiconductor chip; and a plurality of flexible conductor means extending through respective apertures of the connector plate, wherein individual conductor means are soldered at one end to a contact on the chip and at the other end to the transmission means.