초록 ▼

An apparatus for loading a furnace with semiconductor wafers is known, which has at least two heat treatment chambers (1A, 1B, 1C, 1D), each of them having an associated stationary loading unit (8) with a receptacle movable in the direction of the furnace axis via a feed apparatus and having a loadi

An apparatus for loading a furnace with semiconductor wafers is known, which has at least two heat treatment chambers (1A, 1B, 1C, 1D), each of them having an associated stationary loading unit (8) with a receptacle movable in the direction of the furnace axis via a feed apparatus and having a loading system (2A, 2B, 2C, 2D) for semiconductor wafers. In order to provide such an apparatus for automatically loading the furnace with semiconductors which facilitates loading and overcomes the disadvantages of the known apparatuses, the apparatus according to the invention has a common central loading station (9) for all the semiconductor loading systems (2), and these loading systems are removable from the loading unit (8). Further, a transport device (10) is provided which is movable in two directions at right angles to one another as well as at right angles to the axis of the furnace and which has a coupling unit (12) for moving a respective loading system (2), loaded with semiconductor wafers, between the loading station (9) and the furnace loading unit (8).

대표청구항 ▼

The combination of at least one elongated loading system having a tube insertion end, a rearward end and a connecting head located adjacent the rearward end; means for reciprocating the loading system into and out of at least one furnace tube (1) including an elongated stationary support housing (8)

The combination of at least one elongated loading system having a tube insertion end, a rearward end and a connecting head located adjacent the rearward end; means for reciprocating the loading system into and out of at least one furnace tube (1) including an elongated stationary support housing (8) positioned in alignment with the at least one furnace tube, and a connecting device (7) releasably engageable with said connecting head (6) for supporting the loading system, in a cantilever suspended manner upon insertion into the furnace tube, with a common wafer transfer station (9) and with a transport means for transporting said at least one loading system (2) between said connecting device and said wafer transfer station, (9), wherein each loading system comprises a heat shield (5) positioned between the connecting head (6) and a semiconductor wafer (3) supporting portion, extending towards the tube receiving end (16); and the transport means comprises a stationary vertical first beam (11a) located near an end of the support housing (8) remote from the furnace tube; a movable horizontal second beam (11b) supported on said first beam (11a); electrically driven means (MV 10) for moving said second beam (11b) vertically along said first beam (11a); a releasable coupling unit (12) supported on said second beam (11b), and electrically driven means (MH) for moving said coupling unit (12) along said second beam, said coupling unit being selectively engageable with said connecting head (6) and thereby releasing said connecting head (6) from said connecting device (7) and transferring the connecting head (6) to said coupling unit (12), said coupling unit (12), upon decoupling the connecting head from the connecting device (7), supporting the loading system (2) for movement of said loading system, upon further movement of said second beam (11b) from the respective housing to said common wafer transfer station (9).