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An integrated circuit cooling device and a dew point hygrometer employing such a cooling device having a substrate with a peripheral region surrounding a central aperture, the substrate being overlaid by an insulating layer with a Peltier cooling device formed thereon. The Peltier device includes a

An integrated circuit cooling device and a dew point hygrometer employing such a cooling device having a substrate with a peripheral region surrounding a central aperture, the substrate being overlaid by an insulating layer with a Peltier cooling device formed thereon. The Peltier device includes a plurality of alternate metallic segments of dissimilar metals arranged and joined to form first and second groups of corresponding junctions of which the first group is located over the peripheral region of the substrate and the second group is located over the central aperture.

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Integrated circuit cooling apparatus comprising: a substrate having peripheral and central portions; Peltier cooling means formed upon said substrate; and an insulating layer formed between said Peltier cooling means and said substrate, said Peltier cooling means comprising a plurality of first meta

Integrated circuit cooling apparatus comprising: a substrate having peripheral and central portions; Peltier cooling means formed upon said substrate; and an insulating layer formed between said Peltier cooling means and said substrate, said Peltier cooling means comprising a plurality of first metallic layer patterns, each first pattern having an end portion overlaying the peripheral portion of said substrate and an end portion overlaying the central portion of said substrate, and a plurality of second metallic layer patterns disposed in an alternating manner with said first patterns, each second pattern having an end portion overlaying the peripheral portion of said substrate and an end portion overlaying the central portion of said substrate, with junctions being successively formed between end portions of said first metallic layer patterns and said second metallic layer patterns, and with successive ones of said junctions being alternately disposed over the peripheral portion of said substrate and the central portion of said substrate respectively, the central portion of said substrate being removed therefrom.