초록 ▼

A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The apparatus includes a pair of concentric slotted tubular shells wherein one shell rapidly rotates relative to about the othe

A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The apparatus includes a pair of concentric slotted tubular shells wherein one shell rapidly rotates relative to about the other to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.

대표청구항 ▼

An apparatus for mass joining with solder electrical and electronic components assembled on a circuit board wherein said components have leads which protrude therefrom, and comprising in combination: a wave soldering station adapted to provide a wave of molten solder; means for transporting said cir

An apparatus for mass joining with solder electrical and electronic components assembled on a circuit board wherein said components have leads which protrude therefrom, and comprising in combination: a wave soldering station adapted to provide a wave of molten solder; means for transporting said circuit board across said solder whereby a quantity of molten solder may be deposited onto said circuit board underside and said protruding leads; and an excess solder removal station adjacent said wave soldering station, said excess solder removal station adapted to impinge a sweeping fluid blast of continuously varying angle of impingement directed towards the solder wave onto the bottom surface of the board sufficiently soon after it leaves the solder wave so that the solder is still molten, the sweeping fluid blast having sufficient velocity to remove essentially all bridges and shorts but not sufficient velocity to adversely affect properly wetted joints, whereby each portion of the bottom surface of the board may be subjected to a sweeping fluid blast from a plurality of different angles, said excess solder removal station comprising a first fixedly positioned inner tubular shell having at least one inlet and having an open slot directed toward the point where said boards exit said wave, and a second rotatably mounted outer tubular shell having a plurality of elongate spaced slots formed therein, means for rotating said outer tubular shell and fluid supply means for connection to said inlet, said outer tubular shell encompassing and rotating about said inner tubular shell such that fluid emanating from said inner tubular shell will be directed by the open portion of the inner tubular shell through the slot of the outer shell to form a sweeping fluid blast.