초록 ▼

A method is disclosed for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape is made with window-like openings having a relatively thin layer of polyimide spanning the openings. The relatively thin layer of polyimide is transferred to the ta

A method is disclosed for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape is made with window-like openings having a relatively thin layer of polyimide spanning the openings. The relatively thin layer of polyimide is transferred to the tape from a metal carrier foil, preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates which may be handled in the tape format for further processing. Preferably, the tape includes perforations for engaging sprockets of automated manufacturing equipment, or the like.

대표청구항 ▼

A method for making a circuitized flexible film substrate comprising the steps of: coating one side of a carrier foil with uncured polyimide; drying the polyimide on the carrier foil to partially cure the polyimide; coating one side of a tape with an adhesive material, said tape having at least one

A method for making a circuitized flexible film substrate comprising the steps of: coating one side of a carrier foil with uncured polyimide; drying the polyimide on the carrier foil to partially cure the polyimide; coating one side of a tape with an adhesive material, said tape having at least one window-like opening; laminating the tape together with the carrier foil, with the polyimide coated side of the carrier foil facing the adhesive coated side of the tape; removing the carrier foil to leave the tape with a relatively thin continuous layer of polyimide spanning the window-like opening in the tape; fully curing the polyimide on the tape; and circuitizing the polyimide layer spanning the window-like opening in the tape. The method as recited in claim 8 further comprising the step of: mounting an electronic device on the circuitry of the polyimide layer spanning the window-like opening in the tape.