초록 ▼

A composite body consisting of a glass or glass-ceramic substrate with a non-stick, heat resistant resin composition bonded to a surface thereof. Suitable substrates are those which contain one or more differentially etchable components. Particularly useful are glass compositions which undergo phase

A composite body consisting of a glass or glass-ceramic substrate with a non-stick, heat resistant resin composition bonded to a surface thereof. Suitable substrates are those which contain one or more differentially etchable components. Particularly useful are glass compositions which undergo phase separation upon heat treatment. For example, some borosilicate glasses separate into a silica-rich phase and a borate-rich phase when heated to about 600°C. and maintained at that temperature for about one hour. The substrate is etched to remove at least a portion of one component to provide a bonding surface containing extremely small pores of relatively uniform diameter for a non-stick heat resistant resin composition. The resin composition is uniformly applied to the etched substrate in liquid form and subsequently hardened, suitably by fusion, to form a solid, substantially continuous film over the etched surface.

대표청구항 ▼

A composite comprising: (a) a substrate of glass or glass-ceramic having one or more differentially etchable components, the crystals of said glass-ceramic having an average size less than about 5 microns, and said substrate having an etched surface resulting from the differential etching of said su

A composite comprising: (a) a substrate of glass or glass-ceramic having one or more differentially etchable components, the crystals of said glass-ceramic having an average size less than about 5 microns, and said substrate having an etched surface resulting from the differential etching of said surface; the etched surface on said substrate extending to a depth of between about 500-4000 Åwith interconnected pores of relatively uniform diameters of about 50-30,000Årelatively homogeneously dispersed throughout the etched surface; and (b) a non-stick, heat resistant resin bonded to said etched surface through diffusion-type adhesive interaction on a molecular scale, said resin having a thickness of at least about 15 microns. The composite of claim 1 wherein the non-stick, heat resistant resin ranges from about 15 to 30 microns in thickness.