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An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of cont

An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

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A method of attaching electrical leads to an integrated circuit having a plurality of electrical devices connected in an electrical circuit by a network of electrical conduction paths to a first array of input/output contacts comprising the steps of: applying a layer of dielectric over said electric

A method of attaching electrical leads to an integrated circuit having a plurality of electrical devices connected in an electrical circuit by a network of electrical conduction paths to a first array of input/output contacts comprising the steps of: applying a layer of dielectric over said electrical circuit; opening apertures in said layer of dielectric above said first array of input/output contacts; applying a network of electrically conductive paths between said first array of input/output contacts and a second array of input/output contacts disposed in a predetermined pattern on said layer of dielectric; placing an array of electrically conductive leads having attachments tips in proximity to said second array of input/output contacts; and simultaneously forming an electrically conductive bond between at least some of said second array of input/output contacts and at least some of said attachment tips.