초록 ▼

A system for performing one semiconductor manufacturing operation or sequence of operations with reduced particulate contamination. A vacuum-tight wafer carrier, which contains numerous wafers in vacuum in a sealed box, is placed into a platform inside a vacuum load lock. The platform contains slots

A system for performing one semiconductor manufacturing operation or sequence of operations with reduced particulate contamination. A vacuum-tight wafer carrier, which contains numerous wafers in vacuum in a sealed box, is placed into a platform inside a vacuum load lock. The platform contains slots and protruding fingers to provide accurate registration of the position of the wafer carrier. After the load lock is pumped down, the door of the wafer carrier is opened, and a transfer arm removes wafers from the wafer carrier, in any desired order, and transfers them one by one through a port into a processing chamber.

대표청구항 ▼

A load lock comprising: a chamber having a vacuum-sealable lid; space within said chamber for a wafer carrier having a door; and a door opener, positioned inside said load lock in proximity to said space for a wafer carrier, whereby said door opener can open and close the door of the wafer carrier w

A load lock comprising: a chamber having a vacuum-sealable lid; space within said chamber for a wafer carrier having a door; and a door opener, positioned inside said load lock in proximity to said space for a wafer carrier, whereby said door opener can open and close the door of the wafer carrier while said chamber is under vacuum. A method for fabricating integrated circuits, comprising the steps of: (a) providing a plurality of wafers in a wafer carrier box, said wafer carrier box having a vacuum sealable door; (b) placing said wafer carrier box into a load lock attached to a process station, said lock having a vacuum sealable lid; (c) closing said lid and pumping down said load lock to a pressure less than 10 to the -4 Torr; (d) opening said door of said wafer carrier and extending a transfer arm into said wafer carrier, to remove a selected one of said wafers therefrom; (e) transferring wafers in a desired sequence from said wafer carrier to said process station and back by extending said transfer arm through a port between said load lock and said process station, and (f) closing said door of said wafer carrier, closing said port in said adjacent processing chamber, and raising the pressure of said load lock to approximately atmospheric, so that said wafers remain in vacuum inside said wafer carrier and said door of said wafer carrier is held closed by differential pressure; and (g) removing said wafer carrier from said load lock.