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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Method of fabricating multilayer printed circuit board structure

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-003/06    H05K-001/03   
미국특허분류(USC) 156/634 ; 156/253 ; 156/901 ; 174/685
출원번호 US-0817327 (1986-01-09)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 33  인용 특허 : 11
초록
▼

A composite printed circuit board structure including multiple layers of graphite interleaved with layers of a dielectric material, such as a polytetrafluoroethylene (PTFE) and woven glass laminate. Some of the dielectric layers are copper clad, and at least some of the graphite layers are positioned in close proximity to the copper cladding layers, to provide good heat dissipation properties. The PTFE provides a desirably low dielectric constant and the graphite also provides good mechanical strength and a low or negative coefficient of thermal expansio...

대표
청구항
▼

A method of fabrication of circuit boards, comprising the steps of: impregnating a woven graphite cloth with a resin to form a plurality of solid graphite sheets; etching a plurality of copper-clad sheets of polytetrafluoroethylene (PTFE) and woven glass with predefined circuit patterns; and laminating the graphite sheets and the copper-clad sheets, together with other sheets of PTFE and woven glass, to form a composite printed circuit board; wherein at least some of the graphite sheets are positioned in close proximity to some of the copper-clad sheets ...

이 특허에 인용된 특허 (11)

  1. Christie Frederick R. (Endwell NY) Daley Lawrence R. (Binghamton NY). Bismaleimide triazine composition. USP1984064456712.
  2. Olson Larry D. (Viroqua WI). Chip carrier substrates of hybrid woven glass cloths. USP1983114414264.
  3. Spinelli Thomas S. (Attleboro MA) Manns William G. (Dallas TX) Weirauch Donald F. (Dallas TX). Electronic circuit interconnection system. USP1984094472762.
  4. Graham William F. (Wilmington DE). Epoxy imide compositions. USP1981104294877.
  5. Davidson Lewis A. (Reston VA) Duffy Michael C. (Vienna VA) Erickson Alvard J. (Reston VA) Gunther-Mohr Gerard R. (Chappaqua NY) Williams Richard A. (Candor NY). Functional package for complex electronic systems with polymer-metal laminates and thermal transposer. USP1976043952231.
  6. Dtzer Richard (Nuremberg DEX) Lechner Ernst-Friedrich (Erlangen DEX). Heat-removing circuit boards. USP1985014495378.
  7. Hanson John R. (Richmond MA) Hauser James L. (Lenox MA) Kilfeather ; Jr. James F. (Pittsfield MA) Hendriks Hendrik B. (Becket MA). Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion. USP1985064522667.
  8. Pellegrino Peter P. (216 Edgewood La. Apple Valley MN 55124). Method for mass producing printed circuit boards. USP1985064521262.
  9. Huie Jaken Y. (Apple Valley MN) Jacobus Dan (Glendale WI). Method of making a polyimide/glass hybrid printed circuit board. USP1983064388136.
  10. Takahashi Akio (Hitachiota JPX) Shimazaki Takeshi (Hitachi JPX) Wajima Motoyo (Hitachi JPX) Morishita Hirosada (Hitachi JPX). Multi-layer printed circuit board and process for production thereof. USP1985074526835.
  11. Jensen Warren M. (Kirkland WA). Printed wiring board substrates for ceramic chip carriers. USP1982034318954.

이 특허를 인용한 특허 피인용횟수: 33

  1. Humphries, Mark Robson; Ferdinandi, Frank; Smith, Rodney Edward. Apparatus with a multi-layer coating and method of forming the same. USP2015069055700.
  2. Nikkhoo, Michael. Bonded multi-layer graphite heat pipe. USP2017109791704.
  3. Vasoya, Kalu K.. Build-up printed wiring board substrate having a core layer that is part of a circuit. USP2016089408314.
  4. Vasoya, Kalu K.. Build-up printed wiring board substrate having a core layer that is part of a circuit. USP2012068203080.
  5. Nikkhoo, Michael; Hurbi, Erin. Carbon nanoparticle infused optical mount. USP20181010108017.
  6. Bulante Roderick A. ; Duncan Gary L. ; Conwell Troy A. ; Quan Dennis ; Stafford John P. ; Lee Sung H.. Composite heat sink/support structure. USP1999095949650.
  7. Haneda Satoshi (Hachioji JPX) Yoshino Kunihiko (Hachioji JPX). Developing apparatus. USP1990024901116.
  8. Forbord Kent J. ; Sudman Brian W. ; Putnam John S. ; Nielsen Robert J.. Disk drive housing with recess for circuit panel. USP1999115982578.
  9. Brooks, Andrew Simon Hall; Von Werne, Timothy Allan. Electrical assembly and method. USP2015038995146.
  10. Ameen Joseph G. (Apalachin NY) Funari Joseph (Vestal NY) Sammakia Bahgat G. (Johnson City NY) Sissenstein ; Jr. David W. (Endwell NY) Smey Samuel L. (Binghamton NY). Epoxy composition and use thereof. USP1991075028984.
  11. Boyko Christina M. (Conklin NY) Johnston Craig N. (Nicholasville KY) Loomis James R. (Binghampton NY) Samuelson Carl E. (Johnson City NY) Schumacher Ricahrd A. (Endicott NY). Epoxy composition of increased thermal conductivity and use thereof. USP1990104960634.
  12. Cheriff Frank J. (Holliston MA) Kirk Joseph J. (Sudbury MA) Pulver Arnold M. (Sudbury MA) Cox Walter N. (Westboro MA). Flexible cable assembly. USP1991045008656.
  13. Schneider, Douglas; Davis, William E.. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards. USP2016059332632.
  14. Hasegawa, Tsuyoshi. Heat dissipation plate and semiconductor device. USP2010067745928.
  15. Leibowitz Joseph D. (Culver City CA). High-frequency multilayer printed circuit board. USP1989034812792.
  16. Vasoya, Kalu K.; Mangrolia, Bharat M.; Davis, William E.; Bohner, Richard A.. Lightweight circuit board with conductive constraining cores. USP2010027667142.
  17. Vasoya, Kalu K.; Mangrolia, Bharat M.; Davis, William E.; Bohner, Richard A.. Lightweight circuit board with conductive constraining cores. USP2009127635815.
  18. Vasoya, Kalu K.; Mangrolia, Bharat M.; Davis, William E.; Bohner, Richard A.. Lightweight circuit board with conductive constraining cores. USP2005036869664.
  19. LeVasseur Robert D. (Binghamton NY) McKeown Stephen A. (Endicott NY). Low thermal expansion, heat sinking substrate for electronic surface mount applications. USP1990104963414.
  20. Nikkhoo, Michael; Hurbi, Erin. Metal encased graphite layer heat pipe. USP20180710028418.
  21. Ferdinandi, Frank; Smith, Rodney Edward; Humphries, Mark Robson. Method for manufacturing printed circuit boards. USP2017059648720.
  22. Kim, Dong Sun; Kim, Taehoon; Song, Jong Seok; Her, Sam Jin; Park, Jun Heyoung. Method of manufacturing printed circuit board. USP2011118065798.
  23. Sauzade Jean-Denis (Juan Les Pins FRX) L\Hote Manuel (Vence FRX). Mounting for printed circuits forming a heat sink with controlled expansion. USP1989104878152.
  24. Tani,Motoaki; Hayashi,Nobuyuki; Abe,Tomoyuki; Takahashi,Yasuhito; Shuto,Takashi. Multilayer wiring board. USP2006027002080.
  25. Nezu Shinji (Farmington Hills MI). Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof. USP1989064837407.
  26. Kim, Dong Sun; Kim, Taehoon; Song, Jong Seok; Her, Sam Jin; Park, Jun Heyoung. Printed circuit board and fabricating method of the same. USP2010097794820.
  27. Song, Jong Seok; Kim, Taehoon. Printed circuit board and method of manufacturing the same. USP2009107601419.
  28. Ferdinandi, Frank; Smith, Rodney Edward; Humphries, Mark Robson. Printed circuit boards. USP2013078492898.
  29. King David R. (Merion Station PA) Lee Mark S. (Columbia MD) Decker Richard W. (Baltimore MD). Printed circuit boards and method for manufacturing printed circuit boards. USP1989074847446.
  30. Vasoya,Kalu K.. Printed wiring boards possessing regions with different coefficients of thermal expansion. USP2007117301105.
  31. Vasoya, Kalu K.. Processes for manufacturing printed wiring boards. USP201507RE45637.
  32. Adams Jerome T. (Hockessin DE) Yost Bruce A. (Newark DE). Thermally conductive adhesive. USP1991065026748.
  33. Tani, Motoaki; Hayashi, Nobuyuki; Abe, Tomoyuki; Takahashi, Yasuhito; Saeki, Yoshiyasu. Wiring board with core layer containing inorganic filler. USP2005036869665.

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