초록 ▼

The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a layer of foil bonded thereto by a high temperature organic adhesive. The foil may be etched and have a resistive metal alloy tape can be

The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a layer of foil bonded thereto by a high temperature organic adhesive. The foil may be etched and have a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also, layers of foil may be bonded to a substrate and stacked to form multi-layer circuit assemblies.

대표청구항 ▼

The process of forming a circuit assembly, comprising the steps of: providing a ceramic substrate; providing a layer of copper alloy foil having an electrical conductivity of more than about 60% IACS; providing a polymeric material having a process temperature from about 350°to about 500°C.; disposi

The process of forming a circuit assembly, comprising the steps of: providing a ceramic substrate; providing a layer of copper alloy foil having an electrical conductivity of more than about 60% IACS; providing a polymeric material having a process temperature from about 350°to about 500°C.; disposing said polymeric material between said layer of copper alloy foil and said ceramic substrate; heating the assembly of said polymeric material, said layer of copper alloy foil and said ceramic substrate to he process temperature; pressing the assembly together at a lamination pressure whereby said polymeric material bonds said layer of copper alloy foil to said ceramic substrate; and forming electrical circuitry in the layer of copper alloy foil.