초록

A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together.

대표청구항 ▼

In an integrated circuit package having closely spaced external leads subject to unwanted deformation before use, the improvement comprising a lead-forming and protective member made of a nonconductive material affixed to said package over said leads and cooperating with conformations on said leads

In an integrated circuit package having closely spaced external leads subject to unwanted deformation before use, the improvement comprising a lead-forming and protective member made of a nonconductive material affixed to said package over said leads and cooperating with conformations on said leads to retain the leads in predetermined disposition, said protective member having a surface facing the package and projections on that surface for maintaining the leads mutually separated, said external leads contacting at least one edge of that surface and closely wrapping around an adjacent end of said protective member to provide conformation on said external leads such that the leads engage the adjacent end of the protective member to enhance resistance to unwanted deformation.