초록 ▼

In a method and an apparatus for high speed profile grinding of rotatably clamped rotation symmetrical workpieces, a grinding disk of an essentially flat surface line is being guided against the surface of the workpiece so that during the grinding process, the grinding disk touches the circumference

In a method and an apparatus for high speed profile grinding of rotatably clamped rotation symmetrical workpieces, a grinding disk of an essentially flat surface line is being guided against the surface of the workpiece so that during the grinding process, the grinding disk touches the circumference of the workpiece in the region of the finished diameter only at a point which lies perpendicular to the longitudinal axis of the workpiece, whereby the surface line of the grinding disk forms a clearance angle with the circumferential line of the ground surface of the workpiece.

대표청구항 ▼

A method for grinding of a rotation symmetrical workpiece, comprising: clamping in a grinding machine a workpiece having a longitudinal axis and rotating the workpiece about the longitudinal axis thereof, providing a grinding disk having a central axis, a peripheral surface and a leading surface, sa

A method for grinding of a rotation symmetrical workpiece, comprising: clamping in a grinding machine a workpiece having a longitudinal axis and rotating the workpiece about the longitudinal axis thereof, providing a grinding disk having a central axis, a peripheral surface and a leading surface, said grinding disk having a hardness so that the grinding disk wears during grinding, installing the grinding disk adjacent the workpiece so that said peripheral surface is located radially inside and axially adjacent an imaginary cylindrical surface corresponding to the outer surface of the workpiece to be ground, said peripheral surface being arranged relative to the axis of the workpiece to form a clearance angle between said peripheral surface and the surface of the workpiece that is ground, and rotating the grinding disk about the central axis thereof and moving the grinding disk in a direction parallel to the longitudinal direction of the workpiece so that said leading surface engages the workpiece and grinds the workpiece while the grinding disk wears, whereby said leading surface makes contact with the workpiece during grinding and the grinding disk makes only point contact with the workpiece after grinding, independently of the wear of the grinding disk. Apparatus for grinding of a rotation symmetrical workpiece, comprising a grinding machine; means for clamping the workpiece in the grinding machine along a longitudinal axis of the workpiece; a grinding disk having a peripheral surface and a leading surface; means for moving the grinding disk in a direction parallel to the longitudinal direction of the workpiece and radially setting the grinding disk in correspondence with a circumferential profile of the workpiece to be ground; and means for mounting the grinding disk with said peripheral surface arranged with respect to the axis of the workpiece to form a clearance angle between said peripheral surface and the surface of the workpiece that is ground, whereby said leading surface makes contact with the workpiece during grinding and the grinding disk makes only point contact with the workpiece after grinding independently of wear of the grinding disk.