초록 ▼

An integrated circuit is mounted on, and electrically connected to an underlying substrate by the flip-chip technique. In this technique, the chip is inverted and bonding pads on the chip are soldered to correspondingly located bonding pads on the substrate. By the invention a continuous ribbon or l

An integrated circuit is mounted on, and electrically connected to an underlying substrate by the flip-chip technique. In this technique, the chip is inverted and bonding pads on the chip are soldered to correspondingly located bonding pads on the substrate. By the invention a continuous ribbon or loop of solder or polymer extends between the chip and substrate surfaces and defines a sealed cavity. Because the interior of the cavity is sealed from contaminants, conducting leads of the chip or substrate can be left uncovered within the cavity so reducing the capacitance of high frequency circuits. The substrate can be a connection medium such as a printed circuit board or could be another integrated circuit chip.

대표청구항 ▼

An integrated circuit chip package comprising: an integrated circuit chip having a plurality of circuit elements contained therein, said circuit elements being electrically extended to a plurality of bonding pads on a surface thereof, a substrate having a plurality of bonding pads on a surface of th

An integrated circuit chip package comprising: an integrated circuit chip having a plurality of circuit elements contained therein, said circuit elements being electrically extended to a plurality of bonding pads on a surface thereof, a substrate having a plurality of bonding pads on a surface of the substrate, said surface of the substrate facing said surface of the chip, a connection extending from selected bonding pads on the chip to corresponding bonding pads on the substrate, and material extending from said chip surface to said substrate surface for defining a perimeter of a sealed cavity formed between said chip surface and said substrate surface.