초록 ▼

A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permitt

A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).

대표청구항 ▼

A multilayer wiring board comprising a plurality of conductor layers formed one over another each serving as either one of a power/ground line layer and a signal line layer, and a plurality of insulation layers each interposed between two adjacent ones of said conductor layers, wherein each of said

A multilayer wiring board comprising a plurality of conductor layers formed one over another each serving as either one of a power/ground line layer and a signal line layer, and a plurality of insulation layers each interposed between two adjacent ones of said conductor layers, wherein each of said insulation layers which are respectively interposed between two adjacent ones of said conductor layers serving as two power/ground layers with at least one conductor layer serving as a signal line layer also interposed between the two adjacent power/ground line layers is constituted by first and second insulating layer members formed one on the other, said second insulating layer member having a relative permittivity higher than that of said first insulating layer member, said first insulating layer member is disposed in a portion between the adjacent conductor layers serving as power/ground line layers where the density of electric flux created by a signal propagating in said signal line layer is relatively high and said second insulating layer member is disposed in a portion between the adjacent conductor layers serving as power/ground line layers where the density of electric flux created by a signal propagating in said signal line layer is relatively low, and the ratio of the thickness of said second insulating layer member with respect to that of said second insulating layer member is not smaller than about 1.4.