초록 ▼

A circuit board assembly for supporting a leadless ceramic chip carrier for surface mounting on a printed circuit board and for reducing the thermally induced stress on solder joint connections at the carrier-to-board contacts. The board includes an inner heat sink core comprising a highly conductiv

A circuit board assembly for supporting a leadless ceramic chip carrier for surface mounting on a printed circuit board and for reducing the thermally induced stress on solder joint connections at the carrier-to-board contacts. The board includes an inner heat sink core comprising a highly conductive plate having openings provided therein in the areas which underlie the chip carrier. The openings have inserts therein of a material which closely matches the thermal coefficient of expansion of the ceramic to thereby reduce stress of the intermediate solder joints.

대표청구항 ▼

An integrated circuit board assembly comprising: a leadless integrated circuit chip carrier; a plurality of conductive terminals associated with said carrier and extending along one face of said carrier; a printed circuit laminate including a plurality of contact strips, said strips electrically cou

An integrated circuit board assembly comprising: a leadless integrated circuit chip carrier; a plurality of conductive terminals associated with said carrier and extending along one face of said carrier; a printed circuit laminate including a plurality of contact strips, said strips electrically coupled to said terminals via electrical connections; and an inner core on which said laminate is supported, said core including a highly thermally conductive plate having openings therein, said openings located juxtaposed to said one face of said chip carrier and containing inserts having a thermal coefficient of expansion closely matching that of said carrier.