초록 ▼

There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink structure suitable for mounting semi-conductor chips such as IC\s, hybrids, lasers, and power semi-conductors, said heat sink being made of metals, such as tungsten or Molybdenum; ceramics such as alumina, Beryllia, alu

There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink structure suitable for mounting semi-conductor chips such as IC\s, hybrids, lasers, and power semi-conductors, said heat sink being made of metals, such as tungsten or Molybdenum; ceramics such as alumina, Beryllia, aluminum nitride, silicon carbide or variants thereof or other suitable material such as crystalline carbon, said semi-conductor heat sink structure including at least one surface suitable for bonding one or more semi-conductor chips in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said structure providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by formation of nucleate vapor bubbles on said heat exchange surface, the improvement wherein said heat exchange surface includes: means disposed on said heat exchange surface for forming pressure gradients in said liquid having a component perpendicular to said heat exchange surface without substantially impeding the relative velocity between the anode heat exchange surface and said liquid, said component having a magnitude directly proportional to the square of the relative velocity between said anode heat exchange surface and said liquid, to facilitate removal of said nucleate bubbles.

대표청구항 ▼

A semi-conductor heat sink structure including a planar surface suitable for bonding one or more semi-conductor devices in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said structure providing means for enclosing said heat exchange sur

A semi-conductor heat sink structure including a planar surface suitable for bonding one or more semi-conductor devices in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said structure providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by formation of nucleate vapor bubbles on said heat exchange surface, said heat exchange surface further includes one or more adjacent periodic curves across substantially the width of said structure and extending substantially the length of said structure and wherein a liquid coolant diverter is structured in the heat exchange region to provide predetermined liquid flow conditions in the proximity of said heat exchange surface, the improvement wherein said surface for bonding semi-conductor devices includes: channels of predetermined depth and width adjacent to at least two sides of said semi-conductor device and underlying, to a pre-determined distance, said semi-conductor device wherein a semi-conductor device removal tool may be inserted to provide a force for the removal of said semi-conductor device.