$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Printed circuit board load-unload system and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-013/02
출원번호 US-0057647 (1987-06-08)
우선권정보 JP-0007924 (1984-01-21); JP-0007922 (1984-01-21); JP-0007923 (1984-01-21)
발명자 / 주소
  • Sakamoto Hideo (Oyama JPX) Kawakami Yoshikuni (Tochigi JPX)
출원인 / 주소
  • Fujitsu Limited (Kawasaki JPX 03)
인용정보 피인용 횟수 : 34  인용 특허 : 0

초록

A printed circuit board, load-unload system which has a printed circuit board processing portion; a magazine stock portion where a plurality of magazines, each of which houses a plurality of printed circuit boards, is arranged on a conveyor route; and a load-unload portion where one of the plurality

대표청구항

A printed circuit board, load-unload system, comprising: (a) a printed circuit board processing portion including a printed circut board table; (b) a magazine stock portion where a plurality of magazines, each of which houses a plurality of printed circuit boards, is arranged on a conveyor route; wh

이 특허를 인용한 특허 (34)

  1. Bittenbender,Mark David; Liu,Benjamin C.; Bruner,Kevin D., Anti-toppling device for mail with retractable protrusion.
  2. Han Seong Chan,KRX ; Lee Dong Chun,KRX ; Yu Kwang Su,KRX ; Kwon O Kyung,KRX, Apparatus and method for automatically loading or unloading printed circuit boards for semiconductor modules.
  3. Lee, Youngchul; Kwon, Semin; Lee, JinHwan; Oh, Jea-Muk; Lee, Kyungsook; Lee, Nam-Hong, Apparatus and method for manufacturing substrates.
  4. Doyle, Dennis G., Apparatus for depositing viscous material including transport system with upper and lower tracks.
  5. Beers Greg C., Apparatus for loading and unloading circuit boards along a conveyor system.
  6. Gallagher, Niall; Toth, Ted, Apparatus for manufacture of electronic assemblies.
  7. Kim, Taehyun; Lee, Dongsoo; Goh, Seok; Cho, Kyoungbok, Apparatus for mounting semiconductor device.
  8. Hwang, Yisung; Lee, Jungchul; Kim, Jaehong; Chung, Taegyeong, Apparatuses for bonding semiconductor chips.
  9. Hwang, Yisung; Lee, Jungchul; Kim, Jaehong; Chung, Taegyeong, Apparatuses for bonding semiconductor chips.
  10. Hillerich, Jr.,Thomas A.; Neebe,Mark T., Automated induction systems and methods for mail and/or other objects.
  11. Davis,Jeffry A.; Nelson,Gordon Ray; Bexten,Daniel P., Automated processing system.
  12. Davis, Jeffry A.; Meyer, Kevin P.; Dolechek, Kert L., Automated semiconductor processing system.
  13. Nelson, Gordon Ray; Bexten, Daniel P.; Davis, Jeffry A., Automated semiconductor processing system.
  14. Ito, Akira; Kato, Hajime; Kurihara, Kiyokazu, Carriage conveying apparatus.
  15. Sakamoto, Masaru, Component mounting method.
  16. Tsumura Takashi (Osaka JPX) Kawasaki Yasuharu (Nishinomiya JPX) Terada Toshihiro (Osaka JPX), Dispensing method and apparatus, and container transporting apparatus.
  17. Kawase, Takeyuki; Itose, Kazuhiko, Electronic component mounting system.
  18. Seto Katsuyuki,JPX ; Oyama Kazuyoshi,JPX ; Fukushima Yoshiharu,JPX, Electronic component- mounting apparatus and component-feeding device therefor.
  19. Reid Steven J. (Los Gatos CA) Weiss Lewis R. (Scotts Valley CA) Riley Bryan R. (San Jose CA), Handler for IC packages.
  20. Mochida Tooru,JPX ; Baba Shinichi,JPX, Lead frame supplying method and apparatus.
  21. Michenet, Sebastien, Linear machine for processing portable objects and method for processing portable objects.
  22. Simon Ormerod FR; Jean-Marc Bernard FR; Francis Perin FR, Linear personalization machine.
  23. Good, Matthew Gene; Schlender, Robert Lee; Hillerich, Thomas Anthony; Timm, Jacob L.; Miller, Charles Michael; Neebe, Mark Thomas, Mail tray unloader with shuttle transfer through system comprising tilting.
  24. Gieskes,Koenraad A., Method for conveying printed circuit boards.
  25. Jacobsson,Nils; Carlsson,Gunnar, Method for handling boards in a component mounting machine and a component mounting machine for performing the method.
  26. Doyle, Dennis G., Method of conveying printed circuit boards.
  27. Doyle, Dennis G., Method of processing electronic substrates using vertically separated pass through conveyor system.
  28. Ando, Yukio; Hayashi, Masahiro, Printing apparatus.
  29. Wakamiya, Stanley K.; Campagnolle, Pierre J., Rigid storage tray for flat and letter mail.
  30. Douglas John J., Storage buffer for a multi lane conveyor.
  31. Miyoshi Hideaki (Tokyo JPX), Substrate transport apparatus and substrate transport path adjustment method.
  32. Doyle, Dennis G., Vertically separated pass through conveyor system and method in surface mount technology process equipment.
  33. Doyle, Dennis G., Vertically separated pass through conveyor system and method in surface mount technology process equipment.
  34. Mikahara Takanori (Tuchiura JPX), Wafer pick out apparatus.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로