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Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to th 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0866528 (1986-05-23)
발명자 / 주소
  • Brown Candice H. (San Jose CA)
출원인 / 주소
  • Advanced Micro Devices, Inc. (Sunnyvale CA 02)
인용정보 피인용 횟수 : 114  인용 특허 : 0

초록 ▼

The invention discloses an improved PC board package for at least one integrated circuit die utilizing a plurality of PC boards bonded together to form a composite. The composite has at least one cavity, for mounting of an integrated circuit die, formed in at least one PC board of the composite. The

대표청구항 ▼

An improved PC board package containing at least one integrated circuit die mounted therein comprising: (a) a plurality of PC board laminates bonded together to form a composite; (b) at least one cavity, having said integrated circuit die mounted therein, formed in at least a first of said plurality

이 특허를 인용한 특허 (114)

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